RT-121 Compact Root of Trust for IoT and IIoT, sensors and gateways for China market
Improv Systems rolls out SoC partners program
![]() |
Improv Systems rolls out SoC partners program
By Michael Santarini, EE Times
December 26, 2001 (11:03 a.m. EST)
URL: http://www.eetimes.com/story/OEG20011226S0006
User-programmable digital signal processing vendor Improv Systems has launched a partner program with 15 participating companies to help accelerate the use and integration of designer-defined DSPs in system-on-chip (SoC) solutions.
Participants in Improv's Ensemble Partner Program will offer complementary products and services for next-generation communications chips for a wide spectrum of applications, including broadband connectivity, voice-over-Internet Protocol (VoIP), media processing and wireless devices, Improv said.
Initial participants in Improv's Ensemble Partner Program include ARM, Artisan Components, Beatnik, Denali Software, HelloSoft, Hughes Software Systems, Intrinsix, Magma Design Automation, MIPS Technologies, RADVision, Silicon & Software Systems, Synopsys, Tality, Wind River Systems and Virage Logic.
Improv said that it is working with partners to produce tight integration between different hardware and soft ware intellectual property, and to streamline the path to work-ing silicon.
The Ensemble Partner Program includes Platform IP vendors who provide intellectual property that, combined with Improv's Jazz DSP cores, is used to develop complete SoC platforms. The Ensemble Platform IP partners include ARM and MIPS Technologies for embedded processors; Denali for configurable memory controllers; Artisan and Virage for memory compilers; and real-time operating system supplier Wind River.
Design-services companies Tality, Intrinsix and Silicon & Software Systems have joined as Ensemble Approved Design Center partners. Improv currently has Application Solution Kits for the VoIP market. For more information, visit www.improvsys.com.
Intellectual-property provider TTPCom Ltd. planned to demonstrate this month its first iteration of a combination Global System for Mobile Communications and Bluetooth device.
The company's goal is to create an integ rated device that costs $3, cheap enough for second-tier OEMs to build Bluetooth-enabled cell phones, said Charles Sturman, Bluetooth product manager for TTPCom. So far, TTPCom has combined application-level Global System for Mobile Communications and Bluetooth software onto a processor embedded in the GSM baseband chip.
The second and more complex step, which TTPCom expects to complete within a few months, is to integrate the real-time elements of Bluetooth software-the so-called link controller layer-onto the GSM baseband.
Finally, by the second half of 2002, TTPCom hopes to have its GSM and Bluetooth cores integrated as a single baseband chip. While Nokia and Ericsson are likely to accomplish the same feat, TTPCom is aiming to bring the integrated technology to lower-tier OEMs who want to build inexpensive Bluetooth-enabled handsets, Sturman said. More information is available at www.ttpcom.com.
Edited by Michael Santarini with additional re porting by Craig Matsumoto.
Related News
- VESA Rolls Out Early Certification Program for Video Source and Display Products Using HBR3 High-Bandwidth Link Rate
- NEC Electronics Rolls Out USB 3.0 SOC Design Solution to Speed Customer Time to Market
- Envis Rolls Out SOC and IP Power Reduction Services
- inSilicon Rolls Out USB On-The-Go for SOC Designs
- Agnisys Joins Arm Partner Program and Releases Solution Brief for Functionally Safe Arm-Based SoC Design
Breaking News
- RISC-V International Promotes Andrea Gallo to CEO
- See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
- Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
Most Popular
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- SiFive and Kinara Partner to Offer Bare Metal Access to RISC-V Vector Processors
- Imagination Announces E-Series: A New Era of On-Device AI and Graphics
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems to Transform AI-Driven Silicon, Systems and Drug Design
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |