Transmeta and Sony Group Renew Project Agreements for 2006
Update: Intellectual Ventures has acquired Transmeta Patent Portfolio on Jan. 28, 2009
Santa Clara, CA – April 7, 2006 - Transmeta Corporation (NASDAQ:TMTA), the leader in efficient computing technologies, today announced it has entered into a series of new project agreements for Transmeta to continue providing design and engineering services to Sony Computer Entertainment Inc. and Sony Corporation (collectively, the "Sony Group"). These agreements mark the second year of the two-year design services agreement between Transmeta and the Sony Group that was announced in March 2005. Transmeta's first set of project agreements with the Sony Group expired by their terms on March 31, 2006, corresponding to the Sony Group's fiscal year end.
The new project agreements provide for Transmeta to perform a variety of design and engineering services for the Sony Group over project periods ranging from three months to one year, ending March 31, 2007. Under the new project agreements, Transmeta initially will provide the services of more than 100 engineers in the second quarter of 2006 to work on advanced projects for Sony Group. Transmeta and the Sony Group are currently discussing additional potential engineering projects for Transmeta to perform for the Sony Group under the design services agreement.
"I am pleased with the excellent execution by our engineering team during the past year, and I am delighted that Sony is moving forward with us in their new fiscal year," commented Arthur L. Swift, president and CEO of Transmeta. "We continue to believe that Transmeta's low power expertise and advanced design capabilities can contribute strongly to Sony's strategy."
About Transmeta Corporation
Transmeta Corporation develops and licenses innovative computing, microprocessor and semiconductor technologies and related intellectual property. Founded in 1995, we first became known for designing, developing and selling our highly efficient x86-compatible software-based microprocessors, which deliver a balance of low power consumption, high performance, low cost and small size suited for diverse computing platforms. We now also provide, through strategic alliances and under contract, engineering services that leverage our microprocessor design and development capabilities. In addition to our microprocessor product and services businesses, we also develop and license advanced power management technologies for controlling leakage and increasing power efficiency in semiconductor and computing devices. To learn more about Transmeta, visit www.transmeta.com.
|
Related News
- Transmeta and Sony Group Reach Agreement on Multi-Year Strategic Alliance
- OpenHW Group Announces CORE-V CVA6 Platform Project for RISC-V Software Development & Testing
- OIF Marks 25th Anniversary, Launches New Physical & Link Layer Working Group Electrical Project and Adds 112G VSR Clause to CEI 5.0 IA at Q1 Technical and MA&E Committees Meeting
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group
- Google ATAP joins Linaro Mobile Group to extend collaboration in Project Ara
Breaking News
- TSMC September 2024 Revenue Report
- Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
- Intel, TSMC to detail 2nm processes at IEDM
- SensiML Expands Platform Support to Include the RISC-V Architecture
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
Most Popular
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |