Foundry IPOs are finding a cool reception in China
(04/10/2006 10:00 AM EDT)
Shanghai, China — In a country that can only produce about 20 percent of the chips it consumes, a foundry IPO should be a cinch. Should be, but isn't. The tepid response to the recent news of an initial public offering by China's leading analog foundry shows just how tough it is to make chip-manufacturing pay here.
Shanghai-based Advanced Semiconductor Manufacturing Corp. Ltd. (ASMC) is expected to begin trading its shares in Hong Kong this week. However, these days, retail investors favor the hum-drum, low-tech enterprises like Hunan Nonferrous Metals and Nine Dragons Paper over the glitz of modern semiconductor fabs.
This isn't how it was supposed to happen. High tech is popular in China, attracting more than 100,000 fresh graduates a year. The field also enjoys preferential policies from the government and the attention of hundreds of foreign system and chip companies. So what's happening? The answer is pretty straightforward: global competition is getting more severe for fabs in China. Whether it's bulk silicon provider Semiconductor Manufacturing International Co., or niche player ASMC, it's been tough to keep operations in the black.
E-mail This Article | Printer-Friendly Page |
Related News
- China and US Bolster Semiconductor Independence as Taiwan's Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce
- China Forecast to Represent 22% of the Foundry Market in 2020
- China Only Region to Register Pure-Play Foundry Market Growth in 2019
- China Market Drives Essentially All Pure-Play Foundry Growth in 2018
- China Forecast to Account for 90% of Pure-Play Foundry Market Growth in 2018
Breaking News
- Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
- Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
Most Popular
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports