Multi Protocol Endpoint IP Core for Safe and Secure Ethernet Network
Silvus Communication Systems rolls soft PHY core for Wi-Fi
(04/17/2006 9:00 AM EDT)
San Francisco -- A startup spun out of UCLA is developing soft cores for next-generation wireless systems ranging from Wi-Fi to software-defined and cognitive radios.
The first commercial product from Silvus Communication Systems Inc. (Los Angeles) aims to give a leg up to developers of next-generation Wi-Fi chip sets and systems. The company has developed the VHDL software for a physical-layer chip that exceeds the requirements of the upcoming IEEE 802.11n standard. The code, running on a Xilinx Virtex-II FPGA, supports a 4 x 4 matrix for multiple input, multiple output (MIMO), the key antenna technology behind the pending .11n standard.
E-mail This Article | Printer-Friendly Page |
Related News
- Wi-LAN and ASUSTeK Sign Multi-Year Wi-Fi License Agreement
- AMCC and Redpine Signals Collaborate on Next Generation Power Architecture-Based Embedded Wi-Fi Connectivity Solutions
- Wi-LAN and Zonet Sign Wi-Fi License Agreement
- Silvus Technologies and Ittiam Systems Announce Partnership to Provide 802.11n PHY/MAC IP Solution for Highest Wi-Fi Throughput and Extended Range
- Wipro-NewLogics WiLD 801.11a/b/g IP Reference Platform receives Wi-Fi Certification
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing