VinChip Systems Announces Immediate Availability of AHB to PCI Wrapper Module
San Jose, CA. April 21st 2006- VinChip Systems Inc. one of the leading providers of USB (Universal Serial Bus) Intellectual Property announced immediate availability of AHB to PCI Wrapper Module for ease of testing AHB based systems on an PCI Environment and for certifying AHB(AMBA) peripherals in PCI-SIG.
Features:
- VHDL / Verilog source code provided along with synthesis scripts
- Compliant with AMBA Specification (Rev 2.0)
- Compliant with PCI Specification (Rev 2.3)
- Low cost Architecture with low gate count
- More flexibility with ease of Integration to target hardware
- Support for INCR burst
- Supports Sequential and Non Sequential transfers
- Fully synthesizable IP
- Reference software drivers available
- Functionally proven (FPGA)
For more info on the above product please contact info@vinchip.com
About VinChip Systems:
VinChip Systems was founded to fill the design productivity gap brought about by advances in semiconductor manufacturing and reducing product life cycles. VinChip's current focus is on developing IP’s for USB, PCI express, and Wireless USB along with associated software stacks and in providing design services. It is currently developing solutions for Computing, Networking, Consumer electronics, Embedded systems, Avionics and Industrial Systems. VinChip offers substantial cost savings to its customers by providing proven IP’s and design services on-site, or at its design centers located in San Jose and India. For more information visit http://www.vinchip.com
|
VinChip Systems Hot IP
Related News
- PLDA Announces Immediate Availability of the PCI Express EZ IP Module
- Toshiba Announces Immediate IP Subsystem Availability of PCI Express and DDR3 for Custom LSI Platforms
- Cadence Announces Immediate Availability of Industry's First Verification IP for PCI Express 4.0 Technology
- Northwest Logic Announces the Immediate Availability of x8 PCI Express 2.0 Solution For Xilinx Virtex-5 FXT FPGA Platform
- Northwest Logic Announces the Immediate Availability of x8 PCI Express 2.0 Solution For Xilinx Virtex-5 FXT FPGA Platform
Breaking News
- Premier ASIC and SoC Design Partner Rebrands as Aion Silicon
- Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Wi-Fi 7 (802.11be) RF Transceiver IP Core Ready for High Speed Wireless Connectivity Applications
Most Popular
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- BrainChip Extends RISC-V Reach with Andes Technology Integration
- Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |