English
Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
Powerwave acquires DSP and RF design house in U.K.
 |
Powerwave acquires DSP and RF design house in U.K.
By Semiconductor Business News
December 20, 2001 (1:59 p.m. EST)
URL: http://www.eetimes.com/story/OEG20011220S0045
SANTA ANA, Calif. -- Power-amplifier specialist Powerwave Technologies Inc. here today announced it has acquired Toracomm Ltd., a design house based in Bristol, United Kingdom. Toracomm offers a broad range of radio-frequency (RF), digital signal processing (DSP), system design and simulation expertise covering 2G, 2.5G and 3G wireless applications. Toracomm will bring its "expertise in DSP and RF system design to Powerwave's leading engineering and design capabilities," stated Bruce C. Edwards, president and chief executive officer of Powerwave of Santa Ana. This transaction is expected to close on or before the end of December 2001. Upon closure of the acquisition, Toracomm will be renamed Powerwave UK Lt. Terms were not disclosed.
Related News
- RF Engines of the U.K. and a leading U.S. Defense Contractor, close major Pipelined Frequency Transform (PFT) design and licensing deal
- IP99: U.K. design house tunes in to digital-radio library
- Light-Emitting Silicon IP Company Spun-Out in U.K.
- U.K.'s ARM reaches out for new embedded RISC applications
- Linear Tech to open chip-design center in U.K.
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |