Alliance Semiconductor Announces Sale of Mixed Signal Business to Shah Capital
Mel Keating, President and CEO of Alliance, said, "In addition to the cash being generated by these sales, we will be ending the years of losses generated by the semiconductor manufacturing operations that occurred under the prior management. Furthermore, we will be significantly reducing our overhead run rate. When the new Board was elected in October, 2005, Alliance had a worldwide headcount of 238. Following the completion of these two transactions, our headcount will be approximately 30. As a consequence of our reduced headcount, by July 31, 2006, we plan to relocate our corporate headquarters to smaller, much less expensive space. This real estate action alone should further reduce expenses by over $150,000 per month."
Bryant Riley, Chairman of Alliance, said, "This agreement is a significant step in our plan to return value for Alliance stockholders. Now that we have taken steps to stop the operating losses, we can focus on realizing value from the Alliance venture capital investments."
Alliance continues to explore the possible disposition of its remaining memory chip operations.
Related News
- Global Semiconductor Alliance Announces Release of Analog/Mixed-Signal/Radio Frequency Process Checklist Version 1.0
- Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners
- Dialog Semiconductor and Flex Logix Establish Strategic Partnership for Mixed Signal Embedded Field-Programmable Gate Arrays (eFPGA)
- Sankalp Semiconductor Appoints Abhijit Dutta as Head of Mixed Signal Solutions
- INSIDE Secure completes the sale of its semiconductor business to Swiss cybersecurity expert WISeKey
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |