Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Legend's MSIM circuit simulator optimized for 'Subcircuit-type Spice model' for nanometer technology
SANTA CLARA, Calif., May 2, 2006 – Legend Design Technology, Inc. today announced the MSIM circuit simulator has been optimized with orders magnitude faster than the conventional simulators when using 'Subcircuit-type Spice model' for nanometer technology. MSIM is a high-accuracy circuit simulator with post-layout RC reduction capability.
For nanometer technology, Spice models have become more and more complicated for modeling various second-order effects. For example, layout-dependent 'stress effect' was added to BSIM4.3.0 and 'well-proximity' effect to BSIM4.5.0. However, new modeling enhancements and geometry-dependent parameters are continuously needed, particularly in the early stage of advanced process development.
The 'Subcircuit-type Spice model' can provide the flexibility of adding new modeling enhancements, especially for proprietary models. Each MOSFET will be represented as a subcircuit, which contains one basic MOSFET element in BSIM4 model (or others), and a number of resistors, capacitors and diodes for modeling new enhancements. The subcircuit arguments could be the newly added model parameters and device geometries. Major foundries have recently started to release 'Subcircuit-type Spice models' for nanometer technology.
Using 'Subcircuit-type Spice model' could dramatically slow down the conventional circuit simulators, where a large number of subcircuits, analysis operations, model parameter definitions and propagations are inefficiently executed during simulation process. However, Legend's MSIM circuit simulator has been well optimized for excellent performance and memory usage. With the proven accuracy, MSIM has passed all tests with orders magnitude speed improvement over the conventional circuit simulators.
"The 'Subcircuit-type Spice model' is becoming the trend for nanometer designs, e.g. 90nm, 65nm and 45nm technology. That model has caused serious problems of speed and capacity when using with conventional Spice simulators. Legend has successfully optimized MSIM to offer an accurate and reliable simulation solution for those leading-edge customers adopting 'Subcircuit-type Spice model'." said Dr. You-Pang Wei, president and chief executive officer of Legend Design Technology, Inc. "We are fully committed to provide robust circuit simulators that support the sophisticated and updated models associated with nanometer SOC designs."
MSIM circuit simulator with new 'Subcircuit-type Spice model' optimization is available now, starting at $15,000 for a perpetual license.
About Legend
Legend Design Technology Inc. is a leading provider of circuit simulation and semiconductor IP characterization software for SoC designs. With an emphasis on productivity and value, Legend's CharFlo-Memory! toolset revolutionizes the time-consuming and error-prone processes associated with characterization. MSIM is Legend's high-accuracy SPICE circuit simulator with great convergence and extensive model support. Turbo-MSIM is Legend's high-speed and high-capacity circuit simulator ideal for timing and power simulation, and function verification. Both simulators are well designed for nanometer technology challenges, and provide excellent price performance. For more information, visit www.LegendDesign.com.
|
Related News
- Legend's MSIM SPICE Circuit Simulator Certified for TSMC's Advanced Nanometer Circuit Designs
- MSIM Simulator with 5X~10X Speedup for Characterizing CCS Timing Model of Cell Library
- Magma Adopts Legend's MSIM Circuit Simulator for Cell Characterization and Delay Correlation
- Legend releases Turbo-MSIM Fast-SPICE Simulator for Verification, Analysis and Characterization in SoC Design
- Dolphin Technology Endorses Legend Design’s MSIM Circuit Simulator for Signal Integrity Analysis of High-Speed IO Circuits
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |