Mark LaPedus, EE Times(05/03/2006 9:46 PM EDT) SAN JOSE, Calif.
— Seeking to bring its intellectual-property (IP) chip business to the next level, Inapac Technology Inc. has outlined its product roadmap, obtained a new round of funding and named a new sales executive.
Inapac, a system-in-package (SiP) memory integrator, has secured $14 million in a fourth round of financing. This latest round was led by Third Point Ventures and included support from previous investors, according to the company, based here.
The IP chip company also announced that Karen Lamar has joined the management team as vice president of sales. Lamar was previously vice president of worldwide sales and marketing at Monolithic Systems Technology Inc. (Mosys).
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