Knowlent Corporation Closes Second Round Financing, Names New Board Members
Jim Hogan, Bill Nighan Join Board of Directors
SANTA CLARA, Calif. -- May 8, 2006 -- Knowlent Corporation, an analog testbench software and intellectual property (IP) company, recently closed its second round of funding, bringing total capital raised to $3.6 million. Incubic Venture Fund (Mountain View, Calif.) led the round, with existing investor AsiaTech Ventures (Santa Clara, Calif.) participating. The current round will be used for accelerating product development and proliferation; and tapping into the talent pool in China for the company's fast-growing research and development needs.
Knowlent's president and CEO Sandipan Bhanot said, "Analog verification challenges are exploding today. Innovation in this demanding market has been long overdue. We are very happy to have the backing of experienced and savvy investors as we continue serving this need."
Knowlent is also adding two veteran industry investors to its board of directors: Jim Hogan and Bill Nighn.
EDA luminary and new board member Hogan said, "This investment validates Knowlent's strategic focus. Rigorous verification of analog chip content has been a painful time-to-market stumbling block for decades. It has gotten completely out of hand in recent years due to increasing complexity."
Hogan added, "For as long as analog semiconductors have been around, every analog designer has had to write his or her own unique testbench based on individual experience. Every designer, even on the same team, creates testbenches differently with very little re-use. Design groups are battling with these problems with increasing frustration. Knowlent solves these problems with a uniform testbench IP and methodology."
Joining Hogan as the second new Board Member is Bill Nighan, Ph. D, a venture capitalist with Incubic Venture Fund. Nighan has placed several hundred million dollars of high tech products in the field. Incubic is focused on helping entrepreneurs build great and lasting technology companies.
Existing directors are Sandipan Bhanot, Knowlent president and CEO, and Katherine Jen, managing partner of AsiaTech Ventures. AsiaTech maintains a presence in Silicon Valley, Hong Zhou, China and Taipei, Taiwan. AsiaTech provides entrepreneurs with the guidance and resources at each step of the way, with a clear focus on making the business successful.
About Knowlent Corporation
Knowlent Corporation is a Silicon-Valley-based Electronic Design Automation (EDA) and Intellectual Property (IP) startup providing Analog and Mixed-Signal Testbench suites for standard interface specifications such as PCIe, Serial ATA and XAUI. Knowlent is exhibiting at the upcoming Design Automation Conference in San Francisco. Please visit our website to register for a demo of our products.
For more information, please visit Knowlent at http://www.knowlent.com or call (408) 748-0600.
|
Related News
- proteanTecs Closes $45M Growth Equity Round Led by Koch Disruptive Technologies (KDT)
- Movellus Closes Second Round of Intel Capital Funding
- Peraso Closes Oversubscribed $20 Million Equity Financing Led by Roadmap Innovation Fund
- mCube Closes $37M Series C Financing Round
- GainSpan Closes $19 Million Series D Financing Round
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |