English
Pre-Fab Chip Design Takes Root
By Ed Sperling -- 5/30/2006
Electronic News
The chip-building industry is turning to a new pre-fab approach, as companies look to simplify the design and creation of new chips at advanced process nodes.
Faced with a shrinking market for new system-on-a-chip designs if costs and time-to-market concerns aren’t solved, a number of established players have begun rolling out new pre-packaged solutions. IBM, Samsung and Chartered Semiconductor, for example, have banded together to create design for manufacturing kits.
In the EDA world, Cadence Design Systems has created its own design kits that work with those kits. And Synopsys has created an expanded design for manufacturing flow that roughly accomplishes the same thing. And in the IP world, companies such as Rambus and Tensilica have offered up packages of that are backed by a portfolio of proven relevant patents. In Rambus’ case, those patents are for intellectual property, plus options for additional services. In Tensilica’s case, it is patents coupled with off-the-shelf synthesizable cores.
Electronic News
The chip-building industry is turning to a new pre-fab approach, as companies look to simplify the design and creation of new chips at advanced process nodes.
Faced with a shrinking market for new system-on-a-chip designs if costs and time-to-market concerns aren’t solved, a number of established players have begun rolling out new pre-packaged solutions. IBM, Samsung and Chartered Semiconductor, for example, have banded together to create design for manufacturing kits.
In the EDA world, Cadence Design Systems has created its own design kits that work with those kits. And Synopsys has created an expanded design for manufacturing flow that roughly accomplishes the same thing. And in the IP world, companies such as Rambus and Tensilica have offered up packages of that are backed by a portfolio of proven relevant patents. In Rambus’ case, those patents are for intellectual property, plus options for additional services. In Tensilica’s case, it is patents coupled with off-the-shelf synthesizable cores.
Related News
- Europe takes a major step towards digital autonomy in supercomputing and AI with the launch of DARE project
- SkyWater to Acquire Infineon's Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
- Imagination takes efficiency up a level with latest D-Series GPU IP
- ST-GloFo fab plan shelved
- Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |