Redline Selects Sequans Chips for Its IEEE 802.16e-2005 WiMAX Devices
New Indoor Fixed, Nomadic and Mobile Devices to Join Redline's RedMAX Family of WiMAX Forum Certified(TM) Products
CHICAGO, IL--Jun 5, 2006 -- GLOBALCOMM -- SEQUANS Communications and Redline Communications today announced that Redline will incorporate Sequans' system-on-chip (SoC) into its WiMAX CPE and will collaborate with Sequans' ODM partners to manufacture low-cost fixed, portable and mobile WiMAX devices.
In addition, the two companies will perform interoperability tests and jointly participate in WiMAX plugfest events. The companies will submit products for the first wave of mobile WiMAX certification, scheduled for the end of this year.
"We were impressed by Sequans' performance and execution on its 802.16-2004 program and believe that the Sequans team is executing equally well on its 802.16e-2005 solution," said Edgar Masri, Chief Operating Officer, Redline Communications Inc. " The integration of WiMAX technologies based on the 802.16e-2005 standards is an important component of Redline's RedPATH architecture roadmap, which enables operators to benefit from today's WiMAX solutions and evolve with the ecosystem."
"Redline has been at the forefront of the WiMAX industry, being the first to market with 802.16 WIMAX-certified products and helping ODMs immensely in bringing products to market," said Bernard Aboussouan, VP, marketing and business development, Sequans. "We are extremely pleased to partner with such a leader and to help them get their WIMAX products to market fast."
You can visit Sequans this week at GlobalComm at booth 42085C and Redline at booth 39074 and see the companies' WiMAX technologies firsthand.
About Sequans
SEQUANS Communications is a leading supplier of fixed and mobile WiMAX chipsets. Offering both base station and subscriber station system-on-chips (SoCs), Sequans offers equipment manufacturers an all-in-one solution, including full MAC and PHY functionality, enabling them to build the complete range of WiMAX network components: high-end and pico base stations, outdoor and indoor subscriber terminals, home gateways, and mobile devices. Sequans' WiMAX solutions deliver high performance, low power consumption, and incorporate all 802.16 standard requirements as well as additional features for increased coverage and mobility. Sequans' fixed WiMAX products are certified 802.16 2004-compliant and its mobile WiMAX products are expected to be certified before the end of this year. Sequans is based in Paris, France with offices in USA, Israel and Singapore. For more information please visit www.sequans.com.
About Redline Communications
Redline Communications is a technology leader in the design and manufacture of standards-based broadband wireless access solutions. Using industry leading OFDM technologies, Redline's award-winning products provide unmatched high capacity and non-line-of-sight capabilities with proven performance, reliability and security. Ideal for a variety of access, backhaul and private network applications, Redline products meet the needs of carriers, service providers and enterprises worldwide. Redline is a principal member of the WiMAX Forum(TM), and was first in the world to market an 802.16 compliant product. Redline has over 20,000 installations in 75 countries across six continents through a global distribution network of 80+ partners.
|
Related News
- GCT Semiconductor Announces the Industry's First Single-Chip Solution Supporting Both Mobile WiMAX IEEE 802.16e Wave 2 and WiFi 802.11 b/g
- Sequans Provides Chips to USI to Develop Mobile WiMAX End User Devices and System-in-Package (SIP) Modules
- IP Cores, Inc. Announces three low-latency Fast Fourier Transform IP cores for SoC applications in the OFDM-based communications (WiMAX, MBOA, IEEE 802.11) and GPS fields
- TurboConcept's TC1000WiMAX turbo decoder Core incorporated in Sequans' WiMAX chips
- SEQUANS Communications Announces Availability of Its First System-on-Chips for WiMAX Subscriber Stations and Base Stations
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |