ATEME launches EASEE: Audio/Video Software System for TI's DaVinci Technology
Paris -- July 12, 2006 -- Enabling developers to benefit from all the various capabilities of Texas Instruments Incorporated’s (TI) DaVinci technology, ATEME has developed an Audio/Video Software System called EASEE*.
DaVinci technology is tailored for digital video applications, providing optimized software, development tools, integrated silicon and support to simplify design and facilitate innovation. TI’s TMS320DM644x devices based on DaVinci technology are highly integrated system-on-chips (SoCs) and include both TI’s performance-leading TMS320C64x+™ digital signal processor (DSP) core and an ARM926 processor. EASEE takes advantage of both cores to provide one complete system.
The Software System running on Linux resolves all lip synch issues and responds to the requirement for compression, streaming over IP and file containers.
EASEE is composed of:
- a framework, based on the GStreamer core coming from the open source market that ATEME ported to DaVinci technology
- a complete set of audio and video compression and decompression algorithms
- standard streaming protocols
- the most common file containers
The suite of audio and video codecs enables a developer to build any kind of multimedia applications including recorders, players and streamers. On the video side, H.264, MPEG-4, DivX, MPEG-2, WMV9™ decoders and H.264, MPEG-4 encoders are already available. On the audio side, AAC, MP3, MPEG-1 Layer 2 and voice codecs can be added on either the ARM or the DSP.
To interface with the network/Internet, several streaming protocols have been developed including TCP/IP, RTP/RTSP and MPEG-2 TS.
For those who require store or playback features from a hard drive, the need for file multiplexers and demultiplexers has been fulfilled with AVI, MP4, MPEG-2 PS, EXIF.
With all the elements that compose EASEE, developers can easily design any type of digital video equipment. Applications ranging from video security, video conferencing, IP set top box, portable media players, digital media adapters and many others can be efficiently achieved on DaVinci technology using EASEE.
“With DaVinci technology, TI has combined the performance of a DSP with the open structure of an ARM, running Linux, to deliver a flexible SoC optimized for video applications”, said Marc Guillaumet, Business Unit Manager, ATEME. “Thanks to our experience on audio/video systems on DSP, we have taken the full benefits of this architecture to build a rich and flexible software solution as user-friendly as a PC”.
About the Texas Instruments Third Party Program :
ATEME is a member of the TI TMS320 third party program, the most extensive collection of global DSP development support in the industry. With more than 650 independent companies and consultants, TI's customers have easy access to a broad range of application software, development hardware and software and consulting services. For more information on the TI third party program, please visit www.ti.com/3p.
About ATEME:
ATEME (www.ateme.com) is a world-leading provider of MPEG-4 video compression technology. ATEME’s technological solutions are particularly designed for the fields of digital television, video surveillance and professional audio/video applications. They are marketed in the form of FPGA and DSP based software and onboard solutions.
|
Related News
- ATEME launches EASEE: Audio/Video Software System for TI's DaVinci Technology
- HD Enterprise Class Content Distribution and Delivery Now Enabled with Ittiam's Video Networking System on TI's DaVinci digital media technology
- Trinity Convergence Announces Availability of IP Video Phone Software for TI's DaVinci Processors
- eInfochips Announces Smallest Form-Factor System-on-Module Based on TI's DaVinci DM816x and DM814x Video Processors
- Ittiam Systems announces new audio software bundle for Texas Instruments' C64x+ Digital Signal Processors
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |