DFM Parametric Yield Models for Memory IPs
SANTA CLARA, Calif., July 13, 2006 – Legend Design Technology, Inc. announced that its CharFlo-Memory! toolset has been extended for the applications of characterizing DFM ‘parametric yield models’ of memory IPs in SoC (system-on-chip) designs. CharFlo-Memory! has been successfully adopted by major foundries, IDMs and fabless design companies for automatic memory IP verification and characterization.
The proactive DFM (design-for-manufacturing) flow consists of yield models and their characterization of the following
- Random yield models (Defects)
- Design Systematic yield models (Layout), and
- Parametric yield models (Electric)
Nowadays, most DFM companies working on parametric yield models deal with only 'cells' or 'gates', but not memory IPs. However, memory IPs have usually taken the majority of chip areas in SoC designs. Therefore, the effects of memory IPs must be addressed.
With patented technologies, Legend’s CharFlo-Memory! shall enable the parametric yield models of memory IPs. For any memory instance from either commercial or in-house memory compilers, CharFlo-Memory! can automatically generate
- 'Critical-path' circuits, which enables the statistical circuit simulation across process variations by reducing circuit size and simulation time, and
- 'Critical-yield’ signals, which enables the yield analysis across process variations, e.g. sense-amplifier input vs. noise margin.
In memory designs, the most critical 'electric' parameter would be the 'sense-amplifier input voltage', which shall directly impact the yields if less than the noise margin. When it is combined with process variations and statistical modeling, we could get an associated probability distribution related to the parametric yield model. For any memory instance from either commercial or in-house memory compilers, CharFlo-Memory! can accurately characterize the 'sense-amplifier input voltage' at any PVT (process, voltage and temperature) through automatically recognizing those ‘critical-yield’ signals such as sense-amplifier inputs and sensing controls.
"In the DFM flow of variation-aware IC designs, both cell library and memory IPs should be characterized for parametric yield models across process variations." said Dr. You-Pang Wei, president and chief executive officer of Legend Design Technology, Inc. "For cell library, there have already had the EDA tools for statistical timing and extraction results. For memory IPs, Legend’s CharFlo-memory! can be applied for extracting parametric yield models by ‘critical-path’ circuit simulation and ‘critical-yield’ signal analysis. We are fully committed to provide robust DFM solutions that enable the parametric yield models associated with memory IPs in SoC designs."
About Legend
Legend Design Technology Inc. is a leading provider of circuit simulation and semiconductor IP characterization software for SoC designs. With an emphasis on productivity and value, Legend’s CharFlo-Memory! toolset revolutionizes the time-consuming and error-prone processes associated with characterization. MSIM is Legend’s high-accuracy SPICE circuit simulator with great convergence and extensive model support. Turbo-MSIM is Legend’s high-speed and high-capacity circuit simulator ideal for timing and power simulation, and function verification. Both simulators are well designed for nanometer technology challenges, and provide excellent price performance. For more information, visit www.LegendDesign.com.
|
Related News
- OPENEDGES' Memory Subsystem IPs Selected by ASICLAND for Next-gen AI Applications
- OPENEDGES Highlights Advanced Memory Subsystem IPs at the AI Hardware & Edge AI Summit 2023
- Mentor collaborates with Samsung Foundry to boost product yield and streamline in-fab memory testing
- Mentor Graphics Adds Memory Models to Create Industry's First Complete UVM SystemVerilog Verification IP Library
- Synopsys Expands Verification IP Portfolio with Memory Models
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |