CPU Tech and IBM Collaborate on New Class of Semiconductor Devices; Acalis(TM) Programmable Semiconductor Devices add Flexibility, Capacity and Software Compatibility to Multi-Core Processing Solutions
"Size, power and throughput limitations associated with microprocessors are driving the adoption of multi-core computing," said Edward King, CPU Tech's CEO. "SoC technology can effectively solve these problems. However, transition to the multi-core era presents the additional challenge of software compatibility. Acalis, the world's first FPMC product line, can directly execute unmodified legacy application software and simultaneously execute IBM PowerPC multi-core software on a single chip device."
This new generation of programmable semiconductor devices combines the flexibility of FPGAs with the speed and capacity of ASICs. The Acalis family is applicable to a broad range of general purpose and embedded computing systems. Customers can exploit the functionality, performance and compatibility characteristics of a single FPMC across multiple product lines.
Combining CPU Tech's experience and IP with IBM's PowerPC technology will provide customers a programmable, high performance, SoC solution capable of helping customers modernize legacy systems into leading edge systems," said Ron Martino, Director of PowerPC Standard Products, IBM Technology Collaboration Solutions. "We are excited about working with CPU Tech and their new Acalis product offerings."
About CPU Technology, Inc.
CPU Technology, Inc. develops and supplies Compatible System-on-a-Chip solutions for the high-end computing market. The company's products and services directly address the challenges associated with the transformation of microprocessor-based electronic systems to the SoC / MultiCore era. CPU Tech is a privately held company founded in 1989 with headquarters in Pleasanton, CA, and business development offices in Reston, VA. Current investors include The Carlyle Group. Visit www.cputech.com for additional information.
|
Related News
- Software limits multi-core ICs, panelists say
- Freescale announces industry's first 90nm multi-core programmable DSPs in volume production
- Intel will demo its first multi-core CPU at IDF
- AXYS Design Delivers Software Development Support For ARM Powered Multi-Core Designs
- Microchip Technology Expands Processing Portfolio to Include Multi-Core 64-bit Microprocessors
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |