Customer-driven Integration of Sonics SMART Interconnects and CoWare Platform Architect Simplifies Interconnect Optimization in Context of Entire SoC
SAN FRANCISCO, Design Automation Conference--July 24, 2006--Sonics® Inc., the premier supplier of system-on-chip (SoC) SMART Interconnectâ„¢ solutions, and CoWare® Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, announce the availability of SystemC transaction-level models of the SonicsMX SMART Interconnect solution, MemMax memory scheduler and MemDDRC memory modeling solution, that operate seamlessly in CoWare's platform-driven ESL design environment. CoWare will also distribute a limited function version of SonicsStudio, a tool that enables developers to configure and generate specific SystemC TLM models for the SonicsMX, MemMax and MemDDRC products.
Combining the specifically-configured SystemC models with various other models from the CoWare Model Library and utilizing CoWare's performance measurement and analysis tools, SoC developers can now assemble, simulate, analyze and optimize an entire SoC platform within CoWare's Platform Architect. As SoC design has become more complex, the ability to model an entire platform using a SystemC-based methodology is a critical capability for SoC developers to iterate designs faster and more cost effectively and achieve aggressive SoC functionality, cost, and time-to-market goals.
“The seamless integration of Sonics SystemC models with CoWare's modeling tools accelerates the development of SoC designs based on SMART Interconnect solutions,†said Grant Piece, president and CEO, Sonics Inc.
“The integration of Sonics' SMART Interconnect solutions into our ESL design environment was an easy decision for us,†said Alan Naumann, president and CEO, CoWare. “Many of our customers are also Sonics customers, so the integration of our two solutions makes perfect sense. And, we continue to encounter a growing number of opportunities.â€
Sonics and CoWare have produced solutions that are compatible with OCP-IP and OSCI standards and, therefore, are very scalable. Also, both companies have been active in promoting standards-based SystemC modeling. CoWare's SystemC Modeling Library (SCML) enables users to efficiently write SystemC peripherals that can be re-used in SonicsMX-based designs.
Availability
Sonics SystemC transaction-level SMX SMART Interconnect model and MemMaxC and MemDDRC models are available from CoWare as part of the CoWare Model Library. For pricing and more information, contact the CoWare sales office nearest you.
About Sonics
Sonics, Inc. is the premier supplier of SMART InterconnectTM solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics' SMART Interconnects solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures, and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com.