USB2.0 OTG PHY supporting UTMI+ level 3 interface - 28HK/55LL
QUALCOMM and SMIC Form Strategic Agreement for Turnkey Semiconductor Fabrication and Test Services
Commitment to Chinese Industry Helps Shorten Time to Market With More Cost-Effective Process
SAN DIEGO -- July 27, 2006 -- QUALCOMM Incorporated (Nasdaq: QCOM - News), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced a strategic agreement with Semiconductor Manufacturing International Corporation (SMIC) (NYSE: SMI - News; SEHK: 981 - News), one of the world's leading semiconductor foundries. SMIC will provide integrated circuit (IC) manufacturing services to QUALCOMM using a specialized BiCMOS process technology at its Tianjin, China facility. This agreement will combine SMIC's wafer fabrication capabilities and subcontractor infrastructure with QUALCOMM's leadership in 3G wireless technologies, with a focus on power management ICs.
"We are proud to support QUALCOMM with our proven business model and established supply chain network," said Richard Chang, president and CEO of SMIC. "This agreement demonstrates the success of SMIC's continued efforts to offer turnkey solutions to our valued customers. We look forward to a productive relationship with QUALCOMM."
"This strategic agreement with SMIC will allow QUALCOMM to leverage the foundry's operation and management expertise in mixed signal technology manufacturing and supply chain management to serve our customers in China and around the world," said Dr. Sanjay K. Jha, president of QUALCOMM CDMA Technologies. "Not only is this agreement in line with our continued commitment to China, but it also will allow us to further streamline our operations, shorten the development cycle and focus on our core technology offerings."
QUALCOMM is committed to the Chinese wireless industry, and in June 2003, the Company announced plans to invest up to US$100 million in early- to mid-stage Chinese companies engaged in the development and commercialization of CDMA-based products, applications and services. In March of this year, the Company announced the joint founding of TechFaith Software China Limited to focus on the development of application software for mobile devices.
SMIC (NYSE: SMI - News; SEHK: 981 - News) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit manufacturing service at 0.35um to 90nm and finer line technologies. Headquartered in Shanghai, China, SMIC operates three 8- inch fabs in Shanghai and one in Tianjin and one 12-inch fab in Beijing -- the only one of its kind in Mainland China. SMIC has customer service and marketing offices in the U.S., Italy and Japan, as well as a representative office in Hong Kong. For additional information, please visit http://www.smics.com.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2006 FORTUNE 500® company traded on The NASDAQ Stock Market® under the ticker symbol QCOM.
|
Related News
- Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China
- OKI and Wipro Form Strategic Partnership for Semiconductor Design Services
- Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product
- Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement
- Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
Breaking News
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
Most Popular
- Arm's power play will backfire
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era
E-mail This Article | Printer-Friendly Page |