Munich/Germany and Taoyuan/Taiwan – September 18th, 2006 – Qimonda AG and Nanya Technology Corporation today announced the successful qualification of the 75nm DRAM Trench technology, and of the first 75nm product they are each offering to the market, a 512Mb DDR2 memory chip. This next generation technology platform features minimum structure sizes down to 70nm. The technology and 512Mb DDR2 product have been jointly developed at Qimonda’s Development Centers in Dresden and Munich, Germany. Volume production in the new DRAM technology generation has been started at Qimonda’s 300mm production line in Dresden.
“With the qualification of our 75nm DRAM Trench technology and the first product we have reached an important milestone on our technology roadmap,” said Thomas Seifert, Member of the Management Board, Market and Operations at Qimonda. “The 75nm technology platform satisfies the performance requirements of upcoming high speed interfaces such as used for DDR3 and graphics products.”
“This new product features leading edge technologies with minimum geometries as small as 70nm,” said Dr. Pei Lin Pai, Vice President of Global Sales & Marketing and Spokesman of Nanya Technology Corporation. “The advanced technologies enable us for high performance and high density, such as 1Gb / 2Gb DRAM, with competitive cost structure.”
The 512Mb DDR2 product in the 75nm technology that has now been qualified meets the performance requirements at the maximum JEDEC defined DDR2 speed for high end server and computing applications and demonstrate the capability of the company’s 75nm technology for future high speed DRAM products. The introduction of the 75nm technology is not only important for next generation performance requirements but also a further step to improve Qimonda’s and Nanya’s cost position. Process structures of 75nm further reduce chip size compared to the previous 90nm technology thereby increasing potential chip output per wafer by about 40 percent.
About Nanya Technology
Nanya Technology Corporation, a member of the Formosa Plastics Group, is a global leader in advanced memory semiconductors, focusing on research and development, designing, manufacturing, and sales of DRAM products. The company currently owns two 200mm fabs in NanKan, Taoyuan and Linko city. The company’s Fab-3 (300mm), located in Taishan, Taipei, is under construction and planned to be in production in 4Q, 2007. Nanya has launched joint development programs for the 90nm, 70nm and 60nm DRAM technology generations and a 300mm joint venture (Inotera Memories, Inc.) with Infineon Technologies AG from December 2002 to remain competitive in the upcoming “nanometer” era. Nanya Technology Corporation leads the DRAM industry, with advanced technologies, right products, a strong customer base, and a world-class management team. Further information is available at http://www.nanya.com
Qimonda AG, which was carved out from Infineon Technologies AG on May 1st, 2006, and went public at the New York Stock Exchange on August 9th, 2006, is a leading global producer of DRAM memory products. Qimonda was the second largest DRAM supplier by revenue in the first half of the calendar year 2006 (according to the industry research firm Gartner Dataquest). Qimonda generated net sales of €2.8 billion in its 2005 financial year and has approximately 12,000 employees worldwide. The company has access to five 300mm manufacturing sites on three continents and operates five major R&D facilities, including its lead R&D center in Dresden. The company is a leading supplier of DRAM products to PC and server manufacturers and is increasingly focusing on products for graphics, mobile and consumer applications as well using its power saving trench technology. Further information is available at http://www.qimonda.com