Chinese DTV makers form IP alliance
(09/21/2006 9:27 AM EDT)
SHANGHAI, China — With China aggressively pushing analog-to-digital TV conversion, a major DTV alliance is being formed here with the goal of developing intellectual property that will help reduce patent payments to U.S., Japanese and European companies.
The alliance brings together 13 top Chinese TV manufacturers, including Haier, Changhong, Hisense, SVA, Shinco and Skyworth. It will be led by the China Video Industry Association (CVIA), according to Hao Yabing, vice secretary of CVIA.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Cryptomathic and PQShield form strategic alliance to offer PQC solutions for code signing and data protection in compliance with latest NIST and CNSA recommendations
- Via Licensing and MPEG LA Unite to Form Via Licensing Alliance, the Largest Patent Pool Administrator in the Consumer Electronics Industry
- Renesas Electronics to acquire Nokia's wireless modem business; companies to form strategic business alliance for modem technology development
- Chinese set-top box makers, MPEG LA face off over patent fees
- Silterra and Goyatek Form Design Alliance
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation