TI unveils DSP-based digital camera platform
TI unveils DSP-based digital camera platform
By Junko Yoshida, EE Times
July 21, 2000 (2:12 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000717S0015
DALLAS Texas Instruments Inc. will make its first serious foray into the digital still camera market on Monday (July 17) when it unveils a programmable chip that integrates a TMS320C500 digital signal processor and an ARM7TDMI RISC processor with an imaging coprocessor and a variable-length coder. OEMs can design a digital still camera with the fully programmable solution, which allows the addition of such features as the recording of video clips with audio in real-time MPEG-1, MPEG-4 and motion JPEG, or the playing of MP3 music files. Both the imaging coprocessor and the variable-length coder are designed to accelerate image processing. The chip also comes with a hardwired preview engine, SDRAM controller, video encoder and I/O block. Such an architecture makes it possible for OEMs to design a camera that's able to transfer images at 320 megabits/second, preview 30-frames/s NTSC and PAL video, and achieve real-time frame capture in burst mode to the full resolution of the 2-Mpixel image sensor. Samples of the chip are available now, and production volumes are scheduled to become available in the fourth quarter, priced at less than $15 each in volume.
Related News
- TI's kit for DSP-based cell phones has 'click-wrap licensing' for Symbian OS
- Texas Instruments and Ericsson Cooperate on a DSP-based Open Multimedia Applications Platform for Next Generation Wireless Handsets
- TI rolls fourth-generation DSP-based Internet audio device
- Cadence Unveils Millennium Platform - Industry's First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |