September 25, 2006 -- CHANDLER, Ariz.--Amkor Technology, Inc. today announced that it is collaborating with IBM, Chartered Semiconductor Manufacturing and Samsung Electronics Co., Ltd. in qualifying 90-nanometer (nm) and 65nm flip-chip packaging and design capabilities for Common Platform technology. Amkor has already qualified several die and package combinations at both 90nm and 65nm with several new 65nm qualifications in process for the Common Platform partners. Additionally, Amkor has started 45nm qualifications for next-generation semiconductor applications.
Common Platform technology is a collaborative effort by IBM, Chartered, and Samsung to create an open and flexible design and manufacturing environment at leading-edge semiconductor technologies down to 45nm and beyond. With this newest collaboration for optimizing silicon/package interaction for Common Platform technology, customers can now leverage this cross-foundry manufacturing approach to achieve even more complete market solutions.
"It's a simple equation. Successful commercialization of next generation semiconductor technology requires not only advanced silicon, but also the combination of appropriate assembly and test technologies and proven manufacturing scale," said Mike Barrow, Amkor's senior vice president, flip chip business unit. "Changing from individual efforts to joint collaboration with Common Platform partners provides Amkor with early access to advanced silicon, enhancing our ability to develop assembly and test collateral for next-generation applications."
"Extending the Common Platform technology ecosystem to include collaboration on advanced wafer bump and flip chip processes is a natural step in our evolution to provide clients complete solutions," said Kevin Meyer, vice president of worldwide marketing and platform alliances at Chartered. "Amkor's commitment to Common Platform-based technology for partnering on optimized solutions involving manufacturing, packaging and test benefits the entire user community. Additionally, Amkor's commitment to Singapore as a base for Common Platform technology packaging and test services will greatly reduce our customers' time to market."
"Today's announcement underscores the importance that we attach to incorporating advanced assembly and test technology into the Common Platform technology ecosystem," said Ana Hunter, vice president of technology for Samsung Semiconductor, Inc. "We are proud to welcome Amkor as a member of the Common Platform ecosystem, noting that in having already qualified the 65nm process for wafer bump and flip chip assembly, Amkor can provide market-ready solutions for customers. As part of our ongoing collaboration, Amkor and Samsung are also working on lead-free bump and assembly solutions, and we look forward to continuing these efforts as they advance to the 45nm process node."
"Our collaboration with Amkor began in 2004 and continues to provide both IBM and its partners with significant value. Amkor has demonstrated a proven track record in delivering 90nm Common Platform technology solutions, most recently addressing the needs of next generation gaming applications with turnkey flip chip packaging" said Steve Longoria, vice president, Semiconductor Technology Platform for IBM Technology Collaboration Solutions. "The addition of Amkor as a Common Platform technology ecosystem solutions provider enhances our client offerings with the necessary packaging roadmaps, assembly, and test technologies expected by leading edge technology adopters."
"In the past twelve months, Amkor has delivered over 10 million flip chip packages containing 90nm Common Platform silicon from multiple foundries for the gaming market. This proven track record for turnkey package execution has shown Amkor's ability to deliver Customer Ready Technologies to the Common Platform ecosystem," said Amkor's Mike Barrow. "Now we can work more collaboratively with all joint development partners to address increasingly difficult chip-to-package interactions on advanced silicon nodes before customer products are even finalized."
Amkor Technology, Inc. is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com.
About the Common Platform Technology Collaboration
IBM, Chartered and Samsung have broken new ground in the semiconductor industry with a unique collaboration focused on leading-edge, jointly developed digital CMOS process technologies and advanced manufacturing. The Common Platform model is further supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA, IP, and design services industries. This ecosystem allows foundry customers to easily source their chip designs to multiple 300mm foundries with unprecedented flexibility and choice. Common Platform technology features 90nm, 65nm, and 45nm process technologies developed as part of a collaboration between IBM, Chartered, Samsung and Infineon.