English
Chinese companies favoring soft IP
Mike Clendenin, EE Times
(10/30/2006 10:11 AM EST)
TAIPEI, Taiwan — Chinese companies ready to buy intellectual property blocks are favoring design-ins with soft cores rather than hard cores. This is pushing IP vendors to loosen up about delivering RTL code to Chinese customers.
The development is occurring as Chinese companies become more proficient at handling the more design-intensive soft IP, said Chu Lung, president of Asia-Pacific operations for Cadence Design Systems. "Perhaps before, because they did not know how to deal with the soft cores, they would just go to the foundry and use the hard cores," the executive said. "But more and more, as the engineers gain experience, people are using the soft cores in their designs."
(10/30/2006 10:11 AM EST)
TAIPEI, Taiwan — Chinese companies ready to buy intellectual property blocks are favoring design-ins with soft cores rather than hard cores. This is pushing IP vendors to loosen up about delivering RTL code to Chinese customers.
The development is occurring as Chinese companies become more proficient at handling the more design-intensive soft IP, said Chu Lung, president of Asia-Pacific operations for Cadence Design Systems. "Perhaps before, because they did not know how to deal with the soft cores, they would just go to the foundry and use the hard cores," the executive said. "But more and more, as the engineers gain experience, people are using the soft cores in their designs."
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs, Says TrendForce
- Mature Process Capacity to Grow 6% in 2025; Chinese Foundries Lead Expansion
- Logic Design Solutions launches an EXFAT IP Soft Core for NVMe Host
- Qualitas Semiconductor expands presence in chinese market through strategic partnership with chinese chip design company
- Achronix FPGAs Add Support for Bluespec's Linux-capable RISC-V Soft Processors to Enable Scalable Processing
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation