Chinese companies favoring soft IP
(10/30/2006 10:11 AM EST)
TAIPEI, Taiwan — Chinese companies ready to buy intellectual property blocks are favoring design-ins with soft cores rather than hard cores. This is pushing IP vendors to loosen up about delivering RTL code to Chinese customers.
The development is occurring as Chinese companies become more proficient at handling the more design-intensive soft IP, said Chu Lung, president of Asia-Pacific operations for Cadence Design Systems. "Perhaps before, because they did not know how to deal with the soft cores, they would just go to the foundry and use the hard cores," the executive said. "But more and more, as the engineers gain experience, people are using the soft cores in their designs."
E-mail This Article | Printer-Friendly Page |
Related News
- Achronix FPGAs Add Support for Bluespec's Linux-capable RISC-V Soft Processors to Enable Scalable Processing
- Siemens EDA faces Chinese startup competitor
- Analysis: Arm IPO filing reveals depth of Chinese risk
- Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce
- U.S. Blacklists YMTC, 21 Chinese Companies on AI Threat
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024