Experts: design offshoring yielding mixed results
(11/03/2006 1:21 PM EST)
WASHINGTON — The globalization of semiconductor design is providing some competitive benefits for U.S. chip makers but is roiling the U.S. job market for engineers, a university study concludes.
A survey conducted by Clair Brown and Greg Linden of the University of California at Berkeley and presented at a National Academy of Engineering workshop on engineering offshoring found that the U.S. remains the leader in advanced chip design. But growing costs, competitive pressures and globalization are reshaping the industry in ways that are just now being understood.
"So far, offshore activities appear to complement design activities with expansion" in the U.S., the authors found. But the "long-run impact on U.S. leadership and jobs [remains] unclear."
In the meantime, China and India will grow in importance as markets and suppliers of engineers and design skills, they added.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Analog Bits Showcases Silicon of Analog and Mixed Signal IP Products on TSMC N7 Process Targeting Automotive Grade with Split Corner Lots and PVT Characterization Results Available
- TSMC mixed results mirror uncertain outlook
- Alphawave Semi Audited Results for the Year Ended 31 December 2024
- Andes Technology Achieves Record Annual Revenue Amid Strong AI Demand
- Weebit Nano - 1H FY25 financial results
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation