eASIC rolls 90-nm structured ASIC line
(11/08/2006 9:54 PM EST)
SANTA CLARA, Calif. — FPGA vendors claim that they have conquered the ASIC for high-end designs. Some, however, believe that the battle is far from over. Seeking to displace FPGAs and other chip technologies in the marketplace, eASIC Corp. on Wednesday (Nov. 8) came out of its shell with a bang by unveiling a new 90-nm structured ASIC line. The company also disclosed a new foundry partnership with Fujitsu Ltd. and an EDA arrangement with Magma Design Automation Inc.
eASIC's 90-nm offering, dubbed Nextreme, is a family of six programmable structured ASICs, ranging in densities from 350,000 to 5 million gates — at performance levels up to 350-MHz. The Nextreme parts are quick turnaround devices that provide higher speeds but lower power levels than competitive FPGAs and ASICs, according to Ronnie Vasishta, chief executive for eASIC (Santa Clara, Calif.).
The fabless ASIC house also disclosed that it will no longer use STMicroelectronics Inc. (Geneva) as its main foundry. With its older-generation, 130-nm structured ASIC lines, eASIC had its parts built by STMicroelectronics on a foundry basis using a direct-write electron-beam manufacturing process.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Fujitsu hurries 90-nm structured ASIC
- UMC rolls out 90-nm process, says pilot production due in 1Q 2003
- Synopsys Achieves Two IP Firsts: 65-nm PCIe and 90-nm USB Compliance Utilizing Common Platform Technologies
- Mosis offers IBM 90-nm process on MPW
- TSMC: Consumer market, 90-nm driving foundry sales
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024