Kit Pairs Cypress’s Robust WirelessUSB™ LP Radio System-on-Chip With the Winbond Single-Channel W681360 CODEC
SAN JOSE, Calif.-- November 09, 2006--Cypress Semiconductor Corp. (NYSE:CY) today introduced a demonstration kit for a Voice over Internet Protocol (VoIP) headset. The new CY4638 VoIP Demonstration Kit pairs the best-in-class interference immunity of Cypress’s low-power WirelessUSB™ LP (CYRF6936) 2.4-GHz radio system-on-chip with the clean signal delivery of Winbond Electronics Corporation’s W681360 CODEC to provide an easily replicated, fast time-to-market design. The robust solution results in fewer interruptions than headsets using competing wireless technologies, and offers a range over 20-meters.
The WirelessUSB LP headset board includes a Cypress Wireless enCoRe II flash microcontroller, a low power Winbond CODEC, and a rechargeable battery with the radio module. Winbond’s W681360 single-channel voice CODEC is a 13-bit linear analog-to-digital and digital-to-analog converter. The W681360 offers high performance voice quality at the lowest power consumption in the industry, directly impacting talk-time and battery life.
“A primary concern of VoIP headset manufacturers is dropping packets due to interference, making the extremely robust WirelessUSB LP solution a natural fit to deliver an uninterrupted flow of data,” said Matt Branda, senior strategic marketing manager for Wireless Products at Cypress. “Not only does the interference immunity of our WirelessUSB protocol outperform other 2.4-GHz solutions, its robust operation outdoes more expensive Bluetooth and DECT solutions as well. When you add in the excellent signal quality of the Winbond Codec, the CY4638 VoIP Demonstration Kit provides the groundwork for a winning VoIP headset.”
“Combining the W681360 CODEC with Cypress’s WirelessUSB LP is a great match,” said Frank Dowling, Director of Product Marketing at Winbond. “The low power consumption, excellent range, robustness and cost effectiveness our technologies bring to the CY4638 kit are a perfect fit for the VoIP headset market.”
The CY4638 VoIP Headset Development Kit includes all of the following items:
WirelessUSB LP Headset Board – Innovative dual antenna design for robustness. Uses Cypress WirelessUSB LP (CYRF6936), Wireless enCoRe II (CY7C60323) flash MCU and Winbond (W681360) 3V Single-Channel CODEC.
WirelessUSB LP Bridge – Simple, small form-factor bridge. Uses WirelessUSB LP (CYRF6936) and enCoRe III (CY7C64215) USB flash MCU.
WirelessUSB LP Demo Kit CD-ROM – Provides hardware schematics, bill of materials and firmware for Wireless VoIP headset design.
About WirelessUSB LP
Cypress’s WirelessUSB LP offers an unparalleled feature set to enable superior interference immunity, low bill-of-materials (BOM) costs, higher data rate applications, and faster time-to-market for keyboards, mice, gaming devices, presenter tools, and remotes, as well as other simple, multi-point-to-point wireless applications. Featuring a highly integrated radio transceiver plus digital baseband on a single chip, it operates between 1.8 and 3.6 volts, using advanced power-saving techniques to extend battery life in devices such as wireless mice. WirelessUSB LP uses Cypress’s patented frequency agile Direct Sequence Spread Spectrum (DSSS) technology to offer best-in-class interference immunity for a 2.4-GHz radio system. This combination of low power consumption, interference immunity and low cost make it ideal for wireless HID applications.
The WirelessUSB LP VoIP demonstration board is currently available and is priced at $249. For more information please refer to the Developer Kits link on www.cypress.com, or to purchase, click on the Online Store link or contact licensed Cypress distributors. A photo of the demonstration board is available at www.cypress.com/WirelessUSBLP-VoIP-headset-photo.
Winbond Electronics Corporation America, based in San Jose, California, is a wholly-owned subsidiary of Winbond Electronics Corporation, the largest branded IC Company in Taiwan and a leading supplier of semiconductor solutions worldwide. Winbond America designs, develops, markets and sells IC solutions to the global electronics marketplace. With a strong emphasis on mixed-signal solutions, Winbond America’s primary mission is to serve the signal conditioning needs of computer, consumer and communications electronic manufacturers. Winbond Electronics Corporation has approximately 4,400 employees worldwide with design centers in Hsinchu, Taiwan; Shanghai, China; San Jose and Torrance, California; and Austin, Texas. For additional corporate or product information, please visit our website at http://winbond-usa.com for Winbond America, or through the corporate homepage at http://www.winbond.com.
Cypress solutions perform: consumer, computation, data communications, automotive, industrial, and solar. Leveraging proprietary silicon processes, Cypress's product portfolio includes a broad selection of wired and wireless USB devices, CMOS image sensors, timing solutions, specialty memories, high-bandwidth synchronous and micropower memory products, optical solutions and reconfigurable mixed-signal arrays. Cypress trades on the NYSE under the ticker symbol CY. Visit us at www.cypress.com.