TSMC 90nm PCI Express* 2.5Gbps design fully characterized and compliant to specification Los Altos, California, United States - November 20, 2006
-- Rambus Inc. (Nasdaq: RMBS), one of the world's premier technology licensing companies specializing in high-speed chip interfaces, today announced it has released the first physical layer (PHY) high-speed interface design from its Bangalore India Design Center. Based on Rambus’ proven high-speed PHY architecture, the PCI Express* design is optimized for TSMC’s 90nm process node and fully functional in silicon with all necessary tests checked at its maximum data rate of 2.5GHz. The silicon sample meets characterization across voltage and temperature ranges in compliance with the PCI-SIG® specification.
“Mixed-signal designs continue to present one of the most challenging design environments and this accomplishment of first-pass silicon success underscores the India team’s competencies in this area,” said Prakash Bare, managing director at Rambus India. “The Rambus Bangalore team has established itself as a provider of first-class engineering solutions that include design and verification, as well as chip tape-out, bring-up, and characterization.”
The Rambus Bangalore Design Center was established in March 2005 to serve Rambus’ growing customer base in Asia and to strengthen the company’s global presence. The state-of-the-art facility implements technically-advanced designs of high-speed interface cells and cores designed for multiple process technologies. The India engineering team focuses on the development of PHYs and digital cores based on Rambus’ industry-leading technologies, including work in the areas of industry-standard designs such as PCI Express, Serial ATA and DDR2 memory interfaces. The facility has over 80 employees and continues to grow as it supports Rambus customers in their efforts to meet the increasing demands of the global marketplace. About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' technology and products solve customers' most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com