Die-to-Die, 112G Ultra-Extra Short Reach PHY in TSMC (12nm, N7, N6, N5)
Cochlear Limited Selects AMI Semiconductor to Co-Design and Manufacture Future Generation DSP Based System-on-Chip for Cochlear Implants
Pocatello, Idaho - Nov. 27, 2006 – AMI Semiconductor, a leading designer and manufacturer of state-of-the-art integrated mixed-signal and structured digital products for the automotive, medical and industrial markets, today announced that Cochlear Limited (COH.AX), the worldwide leading designer and manufacturer of cochlear implants for hearing loss, has selected AMIS as its semiconductor co-design and manufacturing partner for its future generation DSP-based system-on-chip.
Cochlear implants are a proven treatment for severe-to-profound hearing loss in adults and children. The surgically implanted electronic device bypasses damaged hair cells and stimulates the hearing nerve fibres directly inside the cochlea, providing useful hearing and improved communication abilities to the wearer. External components include a sound processor and transmitter that relay processed signals to the implant using electromagnetic induction. Placed under the skin behind the ear, the implanted components include a receiver and an electrode-array that is placed into the cochlea to stimulate precise locations on the auditory nerve.
Cochlear Limited’s current generation Nucleus Freedom™ system was approved by the U.S. Food and Drug Administration (FDA) in March 2005 and is implanted in over 12,000 patients worldwide.
“Technical leadership and continually advancing the hearing performance, reliability and usability of our devices is fundamental to our strategy,” said Jan Janssen, senior vice president of design and development at Cochlear. “With proven expertise in advanced mixed-signal technologies, deep knowledge of audiological technical requirements and a solid body of existing semiconductor IP, we chose AMI Semiconductor as a technology partner. We believe that with the help of AMIS, we will introduce new capabilities, offering an enhanced quality of life for people with severe to profound hearing loss.”
“We are thrilled to form a technology partnership with Cochlear. Their track record of innovation is truly impressive,” said Todd Schneider, vice president of the medical group at AMIS. “Cochlear implants continue to be the largest segment of the neural prostheses category of neurostimulation medical devices and an area where we’ve developed specific expertise and innovative solutions. This relationship reinforces our belief that customers value a dependable and highly flexible partner dedicated to meeting the specific semiconductor needs of the medical device market.”
About Cochlear Limited
Cochlear is the global leader in the development, manufacture and marketing of innovative implantable hearing solutions. Products include the Nucleus range of Cochlear implant systems and the Baha implant system, a bone conduction implant designed to help those with conductive hearing loss, mixed hearing loss and single sided deafness. Headquartered in Sydney, Australia, Cochlear is an Australian Stock Exchange traded public company with over 1100 employees globally. Additional information about Cochlear can be found at www.cochlear.com.
About AMI Semiconductor
AMI Semiconductor (AMIS) is a leader in the design and manufacture of silicon solutions for the real world. As a widely recognized innovator in state-of-the-art integrated mixed-signal and structured digital products, AMIS is committed to providing customers with the optimal value, quickest time-to-market semiconductor solutions. Offering unparalleled manufacturing flexibility and dedication to customer service, AMI Semiconductor operates globally with headquarters in Pocatello, Idaho, European corporate offices in Oudenaarde, Belgium, and a network of sales and design centers located in the key markets of the North America, Europe and the Asia Pacific region.
|
Related News
- DexCom Selects AMI Semiconductor for Turnkey System-on-Chip (SoC) Design and Fabrication
- Toshiba announces co-design/co-verification platform for collaborative development of chip, package and PCB system
- XpandR - a Wireless Multimedia System-on-Chip Platform to Be Launched by DSP Group
- Micronas launches DSP functionality for audio system-on-chip platform enabling new level of innovation for TV-audio design
- ARC and Global Unichip Partner to Speed Digital Audio System-on-Chip Designs For Greater China's Semiconductor Industry
Breaking News
- CXL Consortium Announces Compute Express Link 3.2 Specification Release
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024
- Alphawave IP - Announcement regarding leadership transition
- Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024
- Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU
Most Popular
- Now Gelsinger is gone, what is Intel's Plan B?
- SmartDV Licenses SDIO IP Family to Ranix for V2X Products
- Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
- IP players prominent in chiplet's 2024 diary
- Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
E-mail This Article | Printer-Friendly Page |