High precision ring oscillator within +/-2% of the specified 22.1184M frequency - 0.18um EF
Chipidea Offers the Industry's Most Advanced Portfolio of AFE and Data Converter IP in IBM, Chartered and Samsung processes
Update: MIPS Technologies Acquires Chipidea (August 27, 2007)
With offerings in 90nm and 65nm, leading analog-mixed signal IP provider announces cores for video, wireless broadband and mobile TV SOCs
LISBON, Portugal – November 29, 2006 – Chipidea, the world’s leading provider of analog/mixed-signal silicon intellectual property, announced today that it provides the widest available portfolio of analog front-end and data converter IP in Chartered Semiconductor Manufacturing’s most advanced foundry process technology. With complete subsystems and individual cores available in 65nm and 90nm technology, Chipidea offers the most compact designs of analog front end (AFE), digital-to-analog and analog-to-digital converter IP for System-on-Chip integration in the video, broadband (m) WiMAX/Wibro, WiFi, Ultra-Wideband and Mobile TV markets.
Chipidea has worked with Chartered Semiconductor Manufacturing, one of the world’s top dedicated foundries, to make the AFE and data converter designs ready on the most advanced process technology available. Intended to ease integration process for designers producing leading-edge SoC devices, this development provides key building blocks and complete sub-systems for consumer electronic devices in fast-growing markets.
The data converter IP was prepared on Chartered’s 90nm and 65nm technologies, part of the IBM-Samsung-Chartered Common Platform. Chipidea’s IP solutions provide SoC builders with greater flexibility to integrate data converter IP into their designs, and heralds Chipidea’s readiness to supply complete analog front-end IP in advanced technology.
“By working with foundry partners and listening to input from customers, we have made our data converter and AFE IP ready for integration and suitable for leading-edge applications,” said João Vital, Chipidea co-founder and vice president of the Data Converter Business Unit. “Our extensive experience in these market segments and in designing AFEs, and our engineer-to-engineer contact help market-leading companies get to market quickly with leading-edge devices. No other IP company matches Chipidea’s breadth of data converter IP in the most advanced process technologies.
The first IP cores designed for advanced process technologies are Chipidea’s Video ADC and Video DAC for High Definition TV, and an IQADC designed for Mobile TV and broadband wireless communications. All the IP cores have flexible power modes suitable for battery powered applications.
Chipidea will soon have available complete low power AFE Video and Wireless communications, and other single blocks designed for IBM’s, Chartered’s and Samsung’s Common platform processes.
About Chipidea
Chipidea Microelectrónica S.A. is the world’s leading provider of analog/mixed-signal silicon intellectual property, according to market researcher Gartner Dataquest Inc. The company is a key supplier to system-on-chip designers targeting fast-growing market segments in wireless communications, digital media and consumer electronics. With the industry’s most comprehensive portfolio of silicon-proven technology across a variety of product lines, Chipidea offers the widest breadth of intellectual property solutions for the world’s multi-function integrated circuit industry. Chipidea works hand-in-hand with its customers to ensure that its unique analog/mixed-signal expertise results in silicon success. Based in Lisbon, Portugal, Chipidea employs 250 people in research, development and sales and marketing offices across Europe, Asia and North America. Information about Chipidea can be found at www.chipidea.com
|
Related News
- Marvell and TSMC Collaborate to Deliver Industry's Most Advanced Data Infrastructure Portfolio on 5nm Technology
- Amkor Joins IBM, Chartered and Samsung to Broaden Common Platform Technology Offerings with Package and Test Solutions for Advanced Silicon Processes
- Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes
- Mentor's High Density Advanced Packaging solution certified for Samsung Foundry's most advanced packaging process
- Multiple Mentor product lines now certified on TSMC's most advanced processes
Breaking News
- TSMC September 2024 Revenue Report
- Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
- Intel, TSMC to detail 2nm processes at IEDM
- SensiML Expands Platform Support to Include the RISC-V Architecture
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
Most Popular
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |