Membership in The SPIRIT Consortium UpgradedMOUNTAIN VIEW, Calif. -- November 29, 2006
-- Sonics Inc.®, a premier supplier of system-on-chip (SoC) SMART Interconnect™ solutions, today announces its status in The SPIRIT Consortium has been upgraded from Reviewing to Contributing member. Sonics continues to explore new methods for opening its highly touted SonicsStudio™ configuration and modeling environment to ensure seamless connection with EDA tools.
“Sonics recognizes that providing an open environment allows customers to take advantage of the superior configuration and modeling features we deliver through SonicsStudio while also giving them an opportunity to incorporate these advantages within their chosen design flows,” says Drew Wingard, chief technology officer, Sonics Inc. “The decision to increase our level of participation within The SPIRIT Consortium is a reflection of our interest in facilitating the creation of an industry standard for seamless interchange of IP-rich designs within EDA design environments.”
The SPIRIT Consortium is a global organization focused on establishing multi-faceted IP/tool integration standards that drive sustainable growth in electronic design. It is comprised of leading EDA, intellectual property (IP), system integration, and semiconductor companies dedicated to the adoption of a unified set of specifications for configuring, integrating, and verifying IP in advanced SoC design tool sets.
“The SPIRIT Consortium recognizes that Sonics is a key contributor to the development and delivery of commercial tools that support highly configurable IP solutions. We look forward to Sonics’ involvement in our development teams and further demonstrating the adoption of IP-XACT™ into multi-vendor tool and IP environments,” said Ralph von Vignau, president of The SPIRIT Consortium.
Earlier this year, Sonics took a first step towards opening its environment by announcing distribution partnerships with ESL vendors such as CoWare Inc. SystemC versions of Sonics SMART Interconnect solutions are now available through these vendors. Broad support for IP-XACT standards among EDA vendors will potentially allow Sonics to offer similar interoperability with IP-XACT compliant design environments.
With over 100 million units shipped, Sonics SMART Interconnect solutions have been used in some of the world’s leading-edge high-end SoCs, such as Texas Instruments’ OMAP application processors for cell phones, HDTV chips developed by Samsung for LCD-based HDTVs, as well as office automation and automotive video processing applications. Market leaders have adopted the SonicsMX® SMART Interconnect™ solution to improve time-to-market, reduce design risks and leverage a high degree of platform-based design flexibility. Sonics also recently announced SonicsLX™, a new SMART Interconnect solution aimed at mid-range SoCs.About Sonics
Sonics Inc. ® is a premier supplier of SMART InterconnectTM solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics’ SMART Interconnect solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com