English
NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
How Real is the Intellectual Property Revolution?
By Ed Sperling -- 12/8/2006
Electronic News
Electronic News sat down to discuss the ins and outs of intellectual property with Juan-Antonio Carballo, partner in IBM’s Venture Capital Group; Michael Farn, a partner at law firm Fenwick & West; Martin Harding, CEO of Tenison, and Jim Turley, consultant and publisher of Silicon Insider. What follows are excerpts of that discussion.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Fabless Semiconductor companies: is intellectual property reuse creating a new model?
- BrainChip's Latest US Patent Award Extends Intellectual Property Strength and its Leadership in Edge Learning
- How Will 5G Advanced Change RF Design?
- GlobalFoundries Files Lawsuit Against IBM to Protect its Intellectual Property and Trade Secrets
- EU Chips Act: Key Intellectual Property Considerations
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation