Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Dolphin Integration Announces their new generation of CODEC providing a Signal to Noise Ratio of 100 dB
A real 100 dB CODEC per the “Practical benchmark”, at no compromise of power consumption, silicon area and yield, was the true challenge now faced successfully.
shCODlp-100.01 is the best contributor to the Return-On-Investment of a SoC:
- a silicon area of 4.2 mm2 for the whole CODEC at no extra fabrication cost: 5 metal layers over a logic process at 0.13 µm
- SNR is guaranteed at ViC level with complete integration guidelines, including characterization to resilience from Rest-of-SoC noise
|
Dolphin Semiconductor Hot IP
Related News
- Dolphin Integration announces the availability at 40 nm of low-power audio codec with SNR of 100 dB
- Dolphin Integration lightens CD10ACN50, a high-performance 100 dB Audio CODEC in Fujitsu Microelectronics' 90 nm
- More configurations for the audio CODEC from Dolphin Integration proven with 100 dB
- Dolphin Integration offers the highest performances for an audio CODEC of the Xenon family: up to 106 dB of SNR at 65 nm.
- The first configuration of Dolphin Integration stars an audio converter at 40 nm LP to a high SNR of 100 dB
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |