Xilinx Delivers 65nm Virtex-5 LX330 - Industry's Largest FPGA
"Shipping the world's largest FPGA demonstrates our ability to smoothly translate leading-edge technology into a real product that delivers unprecedented levels of capability for our customers," said Steve Douglass, vice president of Development Engineering of the Advanced Products Division at Xilinx.
Xilinx Virtex-5 LX devices feature a new advanced architecture enabling up to 30 percent higher design performance with the industry's lowest power consumption for high-performance FPGAs at equivalent logic density levels. The LX platform consists of six devices offering up to 330,000 logic cells, 1200 user I/Os, 10-Mbits of 36-Kbit block RAM, and 3.4-Mbits of distributed RAM, plus an abundance of hardened intellectual property (IP) blocks.
Pricing and Availability
Virtex-5 LX330 engineering samples are shipping now. At customer production timeframes in 2008, the LX330 device will list for $2395 in 1,000 piece quantities. All other members of the Virtex-5 LX platform are shipping as well, including the LX30, LX50, LX85, LX110, and LX220.
About Xilinx
Xilinx, Inc. is the worldwide leader of programmable logic solutions. For more information, visit www.xilinx.com .
|
Xilinx, Inc. Hot IP
Related News
- Xilinx Delivers Virtex-5 LX330T Device - World's Largest FPGA with Serial Transceivers
- Chipworks First Inside Xilinx Virtex-5 FPGA 65nm ''Twins''
- Xilinx Delivers ISE 8.2i - A Complete Logic Design Solution For The New 65nm Virtex-5 FPGA Family
- Xilinx Delivers Virtex-5 LX Devices - World's First 65nm FPGAs In Customer Hands
- Xilinx Delivers Complete Virtex-5 FPGA Solution for XAUI Protocol
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |