TSMC Welcomes Government Approval for 0.18 Micron Generation Technology Transfer to China
“TSMC greatly welcomes the government’s decision,” said TSMC Spokesperson and Vice President Ms. Lora Ho. “The addition of 0.18 micron process technology to our existing 0.35 micron and 0.25 micron process capabilities will help us meet the manufacturing needs of our customers in China, and we believe that we will win more orders and expand TSMC’s market share in China.”
Ms. Ho added that while TSMC will build 0.18 micron semiconductor manufacturing capacity in China in line with government regulations, the company will also expand investment in Taiwan according to its established plans. These include additional construction of advanced 12-inch wafer fabs, as well as continued progress into leading technologies such as the 65 nanometer, 45 nanometer, and 32 nanometer nodes.
|
Related News
- Transmeta to use TSMC for 0.18- and 0.13-micron processors
- eASIC Completes Implementation of Its Configurable Logic Core In TSMC 0.18 Micron Process
- Actions Semiconductor Introduces 0.18 Micron Product with New Power Management Technology
- Grace Semiconductor Expands Access to 0.18- and 0.13-Micron Processes With Adoption of ARM Physical IP
- Atmel's 0.18 Micron Radiation Hardened ASIC Integrates up to 5.5 Million Usable Gates
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |