Faraday and Sidense Announce Joint Marketing Agreement; Faraday chooses Sidense as preferred Logic NVM supplier
Update: Synopsys Expands DesignWare IP Portfolio with Acquisition of Sidense Corporation (Oct. 17, 2017)
Hsinchu, Taiwan and Sunnyvale, California & Ottawa, Canada – January 3, 2007 -- Faraday Technology Corporation (TAIEX: 3035), a leading ASIC and silicon IP provider, and Sidense, developer of Logic Non-Volatile Memory (NVM) IP cores, today announced that they have signed a Joint Marketing Agreement for enhancing global presence and referrals.Under the agreement, Faraday will promote and embed Sidense's Logic NVM products including SiFUSE, a fuse replacement product and SiPROM, a high density, field programmable ROM, as part of their memory IP offering. Faraday will be part of Sidense's Preferred Service Provider program for integrating Sidense's NVM macros.
“We are very excited to have Faraday as part of our Preferred Service Provider program,” said Steve Cliadakis , VP of Worldwide Sales, Sidense. “Faraday's broad presence in the Asia Pacific region as a leading fabless ASIC vendor, and their ability to adjust quickly to growing customer demands, will help accelerate the adoption of our NVM solution. We look forward to numerous successes in the market as a result of this relationship.”
“We continue to expand our silicon IP portfolio in response to the market demand. We are glad to have Sidense as our preferred NVM supplier since they provide an extremely reliable, secure and dense Logic NVM solution and have been highly recognized in the market,” said Charlie Cheng, Corporate VP of Worldwide Marketing at Faraday.
About Sidense
Sidense provides secure, dense and reliable non-volatile memory IP cores for use in standard logic CMOS processes. No additional masks or process steps are required. Sidense's proprietary 1T-FuseTM technology is available in 0.18um, 0.13um, 0.11um, 90nm, and 65nm from the leading foundries. Ideal applications include electrical fuse replacement, flash and mask programmable ROM replacement, code storage, RFID, unique ID, encryption, key storage, HDMI and digital rights management (DRM). The company has offices in Mississauga and Ottawa , Canada and sales offices in San Francisco , CA and Tokyo , Japan . For more information, visit www.sidense.com.
About Faraday Technology Corporation
Faraday Technology Corporation is a leading silicon IP and fabless ASIC vendor. The company's broad SIP portfolio includes 32-bit RISC CPUs, DSPs, MPEG4, H.264, PHYs/Controllers for USB 2.0, 10/100 Ethernet, Serial ATA, PCI Express, Cell Library and Memory Compiler. With more than 650 employees and 2005 revenue of US$175 million, Faraday is one of the largest fabless ASIC companies in the Asia-Pacific region, and it also has a significant presence in other world-wide markets. Headquartered in Taiwan , Faraday has service and support offices around the world, including the U.S. , Japan , Europe, and China . For more information, please visit : www.faraday-tech.com
|
Related News
- Jim Lipman Joins Logic NVM Pioneer Sidense as Marketing Director
- Virage Logic Extends Non Volatile Memory Leadership; Announces AEON(R) Multi-Time Programmable Parallel NVM Qualified in TSMC 130nm G Process
- SMIC Chooses Kilopass Embedded Non-Volatile Memory (NVM) for Its 65nm and 45nm CMOS Logic Processes
- Innovision and NXP announce joint NFC marketing and licensing agreement
- Innovision announces a Joint Marketing and License Agreement
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |