Mitre Corp. Selects Comtech AHA LDPC IP Core for Demonstration on High Data Rate Test Waveform
Comtech AHA Low Density Parity Check (LDPC) codes IP core selected for High Data Rate Demonstration
Moscow, ID – January 25, 2007 – Comtech AHA Corporation (AHA), a wholly owned subsidiary of Comtech Telecommunications Corp. (NASDAQ:CMTL), today announced that the MITRE Corporation has selected Comtech AHA’s Low Density Parity Check (LDPC) coding technology to demonstrate the effectiveness of LDPC on the High Data Rate Test Waveform. This will enable the U.S. government to further assess the use of LDPC technology across the U.S. military’s next generation satellite communications programs.
Engineers at Comtech AHA worked directly with systems engineers at the MITRE Corporation to create a new powerful LDPC coding structure that offers near optimal performance for the code rates and block size specified, while meeting the strict data rate and FPGA resource requirements of the Test Waveform.
“Comtech AHA has a long history of offering high performance forward error correction technology. This latest LDPC solution clearly surpasses the performance and FPGA resource requirements of the High Data Rate Test Waveform” said Jose Torres, Principal Signal Processing Engineer at the MITRE Corporation.
Comtech AHA Corporation’s AHA4703 LDPC IP core will fit into the Xilinx Virtex II Pro family of FPGA devices and achieves data rates above 34 Mbps for all codes. It supports 3 unique code rates with a fixed data block size of 12 k bits. The AHA4703 LDPC IP core can readily support additional FPGA families.
About MITRE
The MITRE Corporation (www.mitre.org) is a not-for-profit company that provides systems engineering, research and development, and information technology support to the government. It operates federally funded research and development centers for the Department of Defense, the Federal Aviation Administration, and the Internal Revenue Service, with principal locations in Bedford, Mass., and McLean, Va.
About AHA
Comtech AHA Corporation develops and markets application-specific integrated circuits (ASICs), boards, and intellectual property core technology for communications systems architects worldwide. Comtech AHA provides flexible, cost-effective solutions for today’s growing bandwidth and reliability challenges. Located in Moscow, Idaho, Comtech AHA has been providing leading edge Forward Error Correction and Lossless Data Compression technology for more than a decade and offers a variety of standard and custom IC solutions for the data communications industry. Comtech AHA Corporation is a wholly owned subsidiary of Comtech Telecommunications Corp. (NASDAQ:CMTL). For more information, visit www.aha.com.
Related News
- Synopsys Enables First-Pass Silicon Success of High Performance NSITEXE Data Flow Processor-based SoC Test Chip for Autonomous Driving
- Comtech AHA Announces GZIP Data Compression Board with Support for Virtual Compression Channels
- New Audio Sample Rate Converter (ASRC) IP Core from CAST Offers Versatility with High Fidelity
- Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4
- MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface To Enable Emerging Vehicle Architectures
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |