Dolphin Integration announces a new stem of Standard Cells for extremely low leakage in TSMC 90LP
In addition SESAME eLLvHD has all the RCSL advantages, as a reduced Cell Set Library, providing the optimal solution for Medical applications, RFID, Smart Cards, Portable multimedia and Wireless applications.
Already available at TSMC 90LP and readily ported to other technological processes, SESAME eLLvHD benefits from a unique “Try and Buy tutorial” for guiding your evaluation, not only for free, but for fun.
More information on www.dolphin-ip.com
|
Dolphin Semiconductor Hot IP
Related News
- TSMC's Extremely Low Leakage Devices on 180nm eLL process empowers Dolphin Integration's IP offering
- Leakage divided by more than 250 at 180 nm eLL with Dolphin Integration Panoply of memory and standard cells
- Dolphin Integration announce the availability of new ROM TITAN and ultra low leakage standard cell library SESAME BIV at TSMC 55 nm LP eFlash
- Standard Cells reducing leakage 40 to 60 times at 90 and 65 nm from Dolphin Integration
- Dolphin Integration completes their catalog of Standard Cell Libraries with a new stem optimized for low leakage: LL-BTF
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |