DigiBee Partners with CEVA for Multimedia and Baseband Platform Solutions

• CEVA-X1620(TM) DSP and CEVA-XS1200(TM) system platform to power DigiBee's integrated baseband and multimedia 3G platform
• CEVA-TeakLite-II(TM) DSP and Xpert-TeakLite-II(TM) DSP subsystem to power baseband solution for GSM/GPRS/EDGE handsets

SAN JOSE, Calif. and BANGALORE, India -- Feb. 7, 2007 -- CEVA, Inc. (Nasdaq: CEVA; LSE: CVA), a leading licensor of innovative intellectual property (IP) platform solutions and DSP cores for wireless, consumer and multimedia applications, and DigiBee Microsystems, India's first mobile handset design and manufacturing company announced today that DigiBee has selected the CEVA-X1620(TM) DSP and the CEVA-XS1200(TM) system platform for its single-chip integrated baseband and application processor solutions. These solutions are based on DigiBee's unique, scalable and proprietary architecture utilizing a single RISC and a CEVA DSP platform, providing a very cost effective Communication and Application Processing (CAP(TM)) platform for its range of feature-rich, multimedia, GSM/GPRS/EDGE/3G mobile handsets. DigiBee is also using the CEVA-TeakLite-II(TM) DSP and Xpert-TeakLite-II(TM) subsystem for developing a wireless baseband processor solution targeting the cost-competitive mobile handset segment.

DigiBee has already developed the mobile platforms based on the CAP approach to power its portfolio of "value for money" GSM/GPRS/EDGE/3G mobile multimedia handsets using CEVA's flagship CEVA-X DSP technology. DigiBee's solution utilizes the performance capabilities of the CEVA-XS1200 for multimedia processing using the dedicated multimedia instruction set and leveraging the DSP for executing compute-intensive baseband and multimedia functionality of the System-on-Chip (SoC). For the price-sensitive GSM/GPRS handset market, DigiBee is leveraging the low power consumption and industry- proven performance of the CEVA-TeakLite architecture to develop a baseband processor that offers the optimal balance of price, power and performance for low-to mid-end phones.

"The CEVA DSP-based portable multimedia and wireless technologies offer exceptional performance, innovative power-saving techniques and ease-of- integration for the development of our low-power, high-quality multimedia and wireless solutions for GSM/GPRS/EDGE/3G handsets," said Suresh Dholakia, CEO and president, DigiBee Microsystems. "In addition, CEVA's comprehensive suite of software and hardware tools has enhanced our product development and helped us significantly reduce time-to-market for our handset products."

"We are pleased to announce DigiBee as a strategic partner, having licensed our CEVA-X1620 DSP and CEVA-XS1200 system platform in addition to our CEVA-TeakLite-II DSP and Xpert-TeakLite-II subsystem," said Gideon Wertheizer, CEO of CEVA. "Our DSP-based multimedia platforms and wireless subsystems are optimised to deliver high-performance multimedia and baseband processing in low-power mobile applications. In choosing our industry-leading solutions, DigiBee is equipped with the latest technology and resources to achieve faster time-to-market for a wide range of mid- to high-end mobile multimedia and wireless products."

About DigiBee Microsystems

DigiBee (DGB) Microsystems is a privately held Indian company founded in March 2004. DGB is one of India's leading mobile handset designing and Manufacturing Company. DGB has established worldwide offices in USA, India, Korea and China. DGB's office in USA functions as the sales, marketing and customer support arm for Carriers in Americas, while it's offices in Bangalore and Chennai are involved in handset R&D and sales and marketing for the Indian markets. DGB's design center in Korea, focuses on world class design for GSM, CDMA and WCDMA handsets while its procurement and compliance centres in China work very closely with global manufacturers and component suppliers to ensure delivery of stringent quality products.

About CEVA, Inc.

Headquartered in San Jose, Calif., CEVA is a leading licensor of innovative intellectual property (IP) platform solutions and DSP cores for wireless, consumer and multimedia applications. CEVA's IP portfolio includes comprehensive platform solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices. More information on CEVA DSP cores, subsystems and platform solutions can be found at http://www.ceva-dsp.com.

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