Over 200 Million SoCs Now in Production Using Sonics SMART Interconnect Solutions

Semiconductor Suppliers and OEMs Fuel Accelerated Growth

MOUNTAIN VIEW, Calif., - March 1, 2007 -  Sonics Inc., a premier supplier of system-on-chip (SoC) SMART Interconnect  solutions, today announced that a widening base of customers have now shipped more than 200 million SoCs incorporating Sonics’ solutions. The announcement represents a significant acceleration in the adoption rate of Sonics’ solutions and further demonstrates Sonics’ leadership position in the interconnect segment of the semiconductor intellectual property market.

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“The convergence of communications and digital multimedia continues to drive the massive increases in functionality and performance required in order for an SoC to be competitive,” said Grant Pierce, chief executive officer, Sonics Inc. “We are seeing semiconductor suppliers seeking the right platform SoC architectures to remain competitive, while OEMs are shifting from system hardware to system software differentiation as all the hardware functionality collapses into one SoC device.  Our semiconductor and OEM customers are leveraging Sonics’solutions to achieve and maintain their market-leading positions.”  

The complexity of today’s SoCs has shifted development priorities.  In the past, IP core selection would determine the overall functionality and performance of the SoC device. Today, in a multi-core SoC environment, IP core interoperability and data flow management more directly determines an SoC’s overall functionality and performance, as well as the software that operates on that “system.”  SoC interconnect selection has become the most important decision for both SoC and software performance. The rapid expansion of Sonics’ served markets, which now includes mobile phones, gaming platforms, HDTVs, communications routers, as well as automotive and office automation products, clearly shows that these issues are pervasive in the semiconductor industry.

OEMs use SoC interconnect technology as a means of ensuring that key algorithms and application software they develop will also operate optimally on the SoCs they utilize. By using Sonics solutions, OEMs take advantage of SoC data flow modeling and design to improve their overall system understanding of functionality and performance, enabling senior OEM managers to better predict and plan their offerings, as well as improve communication with their semiconductor suppliers.  

About Sonics

Sonics Inc. is a premier supplier of SMART Interconnect solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics’ SMART Interconnect solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com

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