OCP-IP Highlights Toshiba's Use Of OCP In Leading-Edge Super Companion Chip
BEAVERTON, OR — March 12, 2007 — OCP-IP today announced that the OCP interface is at the heart of the Toshiba Super Companion Chip (SCC). The SCC is not a single-application processor, but spans a range of devices with multiple uses and flexibility, which represents yet another large usage point for the OCP interface.
The SCC is designed to make optimal use of the Cell Broadband Engine (CBE) and expand its applications to the audiovisual (AV) and network markets. The SCC realizes the high performance communication with the CBE, the high band-width DDR2 memory interface and the hierarchical internal bus having a quality of service (QoS) structure.
Using OCP in SCC chips allows Toshiba designers to build the SCC independent of specific bus protocols, and of any particular design implementation. This ensures redeployment of fully reusable OCP-compliant cores across multiple designs. OCP eliminates the need to repeatedly modify the core itself, and preserves the verification and test benches by defining all the core's natural interface capabilities to be presented in an unchanging, universally understood manner.
Toshiba is a Governing Steering Committee member of OCP-IP. Demonstrating its support for open standards and specifications, Toshiba developed the SCC in compliance of the OCP specification.
"Toshiba believes that nothing is more important to achieving reasonable development costs and shorter time to market with complex SoC’s, than the IP-core interface scheme. For this reason we have chosen OCP as the standard for Toshiba in the SCC," said Takashi Yoshimori, Technology Executive SoC Design Toshiba Corporation. "The SCC is another example of a high-volume production product based on the OCP specification."
“Standards are only proven through real-world implementations, and many of our founding members, companies with world-class SoC design expertise, have adopted OCP and applied it in SoC designs, said Ian Mackintosh president OCP-IP. “With numerous applications planned, the use of OCP in the SCC architecture is another prolific illustration of the support and adoption for the specification throughout the industry“.
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants include: Nokia [NYSE: NOK], Texas Instruments [NYSE: TXN], Toshiba Semiconductor Group (including Toshiba America TAEC), and Sonics. OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. VSIA endorses the OCP socket, and OCP-IP is affiliated with VSIA. For additional background and membership information, visit www.OCPIP.org.
|
Related News
- OCP-IP Highlights Texas Instruments Use of OCP in Leading-edge OMAP 2 Architecture
- OCP-IP Highlights Successful Implementation of Advanced OCP Features in Leading-Edge Designs
- World's Largest Semiconductor Memory Conference Highlights Leading-Edge Memory and Storage Solutions
- Part 2 of OCP-IP's Network On Chip Benchmarking Specification Released to Member Review
- OCP-IP Announces Support for Cadence's Assertion Based OCP Protocol Verification IP
Breaking News
- CXL Consortium Announces Compute Express Link 3.2 Specification Release
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024
- Alphawave IP - Announcement regarding leadership transition
- Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024
- Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU
Most Popular
- Now Gelsinger is gone, what is Intel's Plan B?
- SmartDV Licenses SDIO IP Family to Ranix for V2X Products
- Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
- IP players prominent in chiplet's 2024 diary
- Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
E-mail This Article | Printer-Friendly Page |