Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Tokyo Electron Device Announces the Industry's Highest Performance Virtex-5 LX 330 Evaluation Platform
Santa Clara, CA., March 15, 2007 - Tokyo Electron Device, Ltd. (TED), today announced it has developed the highest performance multi-application evaluation platform for the XilinxR Virtex-5 LX 330 and its family, which today is the industry's highest density and highest performance FPGA in the market. TED's new Virtex-5 LX Multi-Application Evaluation Platform enables efficient design and evaluation of a wide range of high-speed applications, including consumer products such as high definition televisions, set-top boxes and printers, as well as telecommunications equipment, medical devices and miscellaneous industrial equipment.
"As a leading Xilinx's distributor in Japan, TED is pleased to have again collaborated with Xilinx in developing this new Virtex-5 evaluation platform," said Toshiaki Sunagawa, president and representative director of TED. "The Virtex-5 family is the flagship FPGA for Xilinx and a key new addition to our line of inrevium board products."
Built with TED's inrevium? TE7725PF, a low-cost FPGA configuration control LSI, the Virtex-5 LX Multi-Application Evaluation Platform meets the rapidly growing market demand for a development environment that enables design engineers to rapidly evaluate high-speed interface technologies such as DDR2-SDRAM and LVDS. The Virtex-5 LX platform also features:
- Xilinx XC5VLX110 or 220 or 330-1FF1760, the industry's first 65nm FPGA and Xilinx's flagship high density and performance FPGAs
- On-board DDR2-SDRAM chips (667Mbps) and DDR2 SO-DIMM slot to evaluate high-speed memory access
- Reference design of high-speed DDR2-SDRAM memory interface
- 10/100 Ethernet, RS232C and LVDS interface ports
- Expansion I/O ports for optional interface boards including DVI Tx/Rx, Camera Link, Optical Link and USB
- " High Efficiency DC/DC ƒÊModule from Linear Technology (LTM4600)
Pricing and Availability
All Virtex-5 LX110/220/330 platforms are available now, with prices starting at US$4,980. The platform is available through TED's worldwide distributor partners, HiTech Global Distribution, LLC (http://www.hitechglobal.com) and Nu Horizons Electronics Corp. (http://www.nuhorizons.com).
About Tokyo Electron Device Limited
Tokyo Electron Device is an affiliate of Tokyo Electron Limited, one of the world's leading semiconductor manufacturing equipment suppliers. TED has sold its technology as a specialized electronics trading company inside Japan about 40 years, and now the company is applying its knowledge, technology and service capability to establish its inrevium product line in the global industrial market. For more information on inrevium products, visit the website at www.inrevium.jp/eng/.
|
Related News
- Tokyo Electron Device Announces New Virtex-5 FPGA LX330 Evaluation Platform For ASIC Prototyping
- Xilinx Ships World's Highest Performance DSP Platform with New Virtex-5 SXT FPGAs
- Xilinx Unveils 65nm Virtex-5 Family - Industry's Highest Performance Platform FPGAs
- Tokyo Electron Device Announces Quad Virtex-5 FPGA Platform For High-Speed Computing
- Xilinx Introduces the World's Highest Performance Reconfigurable DSP Solution
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |