Open Core Protocol International Partnership Releases OCP SystemC Channel Version 2.2
BEAVERTON, Ore.-- March 22, 2007 --Open Core Protocol International Partnership (OCP-IP) today announced the availability of the SystemC Transaction Level Model (TLM) Channel version 2.2. The new release provides full support of OCP 2.2 including support for the new 2D bursts and pipe-lined thread busy features. The latest enhancements further improve model interoperability, ensuring maximized productivity in system level modeling.
In addition, the support of OCP 2.2 features is also reflected in the adapters provided by the channel that are used to move between different levels of abstraction. Also included are enhancements to the monitor interface, and documentation.
Version 2.2 again represents a most comprehensively tested release utilizing the previously announced regression suite donated to OCP-IP from the ESL Working Group of Taiwan SoC Consortium, sponsored by Industrial Development Bureau, Ministry of Economic Affairs, Taiwan. The regression suite allows OCP-IP to ensure a superior level of code testing is accomplished before channels are released.
Work on the release was completed by the OCP-IP System Level Design Working Group including: CoWare, GreenSocs, Sonics, and Texas Instruments. Additional testing was graciously performed by other EDA member companies.
“OCP-IP has shipped many thousands of copies of TLM work over the years and we are particularly proud of their quality and ongoing progression,” said Mark Burton, chairman OCP-IP System Level Design Working Group. “It is a pleasure to head this group of experts from leading companies engaged in transaction-level modeling.”
For more information please visit www.ocpip.org
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants include: Nokia (NYSE:NOK), Texas Instruments (NYSE:TXN), Toshiba Semiconductor Group (including Toshiba America TAEC), and Sonics. OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. VSIA endorses the OCP socket, and OCP-IP is affiliated with VSIA. For additional background and membership information, visit www.OCPIP.org.
|
Related News
- Open Core Protocol International Partnership Releases OCP SystemC Channel Version 2.1.3
- Open Core Protocol International Partnership Releases OCP SystemC Channel Version 2.1.2
- Open Core Protocol International Partnership Releases OCP SystemC Channel 2.1.1 and Methodology White Paper
- Aldec Releases Riviera-PRO(TM) 2008.02 with VHDL 2007, SystemC 2.2 and SystemVerilog (DPI)
- Digital Blocks Extends the DB9000 TFT LCD Controller IP Core Family with the availability of the DB9000OCP for the Open Core Protocol 2.2 Interconnect
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |