Dolphin Integration releases its RAM for 90 nm nodes with dual optimization: for ultra-low power and for extremely high density
Saving both ultra-low dynamic power and leakage, while maintaining an extremely high density, is a dream of every SoC integrator. With the announcement of its upcoming product, spRAM uLCeHD: URANUS 90LP/GP this Provider is on its way towards fulfilling this paradoxical dream.
It enables traveling with portable devices which demands these three important characteristics. The product is released at once in LP as well as in GP process and available on request at half nodes.
For more information, please visit:
http://www.dolphin.fr/flip/ragtime/90/ragtime_90_ram.html
|
Dolphin Semiconductor Hot IP
Related News
- Ultra high density standard cell library SESAME uHD-BTF to enrich Dolphin Integration's panoply at TSMC 90 nm eF and uLL
- Dolphin Integration announces its ultra low power, low leakage and High density 65 nm ROMs and RAMs
- DOLPHIN Integration releases a ROM in 65 nm with Ultra high density and ultra low leakage
- PixArt Imaging selects voltage regulators IPs from Dolphin Integration for its ultra-low power MCU Sensor in 40 nm
- Dolphin Integration enable Dongbu HiTek's users to benefit from their ultra high density standard cell library
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |