Exec Q&A: TI's DSP, ASIC chief
(04/01/2007 2:02 PM EDT)

Hames, who joined TI in 1980, is responsible for the development, manufacturing and marketing of DSPs, microcontrollers, ASICs and Sparc products at the company. In a recent interview, the TI executive also talked about DSP farms, multicore devices, IC design and the overall challenges of the IC industry. TI also has its own set of challenges.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Q'comm Exec: "Automotive Changed Our DNA"
- Former Intel exec to lead Arm's automotive and embedded business
- TI's multicore software development kit extended to low-power DSP + ARM devices
- Express Logic's ThreadX RTOS Supports ARM and TI DSP Processors on Critical Link's MityDSP-L138F Board
- Ittiam Systems announces new audio software bundle for Texas Instruments' C64x+ Digital Signal Processors
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation