eSilicon Optimizes Arm Processor For TAK IMAGING
SUNNYVALE, Calif. — April 04, 2007 - eSilicon Corporation, a pioneering semiconductor Value Chain Producer (VCP), today announced it has implemented an ARM926EJ-ST processor core for TAK Imaging, a leading provider of image processor solutions for the consumer photo printer market. The eSilicon® implementation of the core is 55% smaller than available pre-hardened cores, making it an ideal solution for the cost-sensitive photo printer market.
TAK Imaging needed a small, cost-effective solution for its digital printer chip. However, pre-hardened cores offered by foundries are typically optimized for maximum performance at the expense of power and area. eSilicon focused on design for minimal area when hardening the ARM® core. By targeting TAK Imaging's specific cache configuration and speed requirements, eSilicon was able to reduce the overall core size by more than half compared to other off-the-shelf, pre-hardened core offerings in the same process technology.
"We have seen a growing demand for specialized implementations of ARM processor cores in situations where either a pre-hardened core was not available in the required process technology, or where the available pre-hardened cores failed to meet our customers' needs," said Hugh Durdan, vice president of Marketing, eSilicon. "By using our ARM processor expertise and internal development techniques, we were able to design the core implementation to fit TAK Imaging's specific requirements."
"eSilicon's implementation of the ARM926EJ-S processor core enabled us to significantly reduce the die size and cost of our printer controller chip and enabled us to focus on the value-added application-level features of our solution rather than spending our time on the details of the physical implementation of the device," said Christian Joly, CEO, TAK Imaging.
About eSilicon Corporation
eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production. The company delivers chips to system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments. eSilicon - Enabling Your Silicon SuccessT. For more information, visit http://www.esilicon.com.
|
Related News
- New eSilicon Peripheral Subsystem offers Design Flexibility for ARM Processor-Based Chips
- TAK’ASIC receives $16.25 million Series C funding to fuel expansion of its growing imaging processor business
- C-DAC partners with MosChip and Socionext for design of HPC Processor AUM based on Arm architecture
- Nordic Semiconductor and Arm reaffirm partnership with licensing agreement for latest low power processor designs, software platforms, and security IP
- Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |