NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
A panel discusses 65-nm mixed-signal design
(04/20/2007 5:52 AM EDT)
NICE, France -- The demand for analog/mixed-signal intellectual property (IP) blocks has never been greater, especially at the 65-nm process node and below. At a panel discussion at the DATE conference this week in Nice, France, speakers called for a new breed of analog designers who would be able to face the power dissipation constraints, due to the increased leakage, device variability and model accuracy, and new design methodologies and tools for enhanced reliability.
"Today, at the 90-nm process node, we are able to integrate multiple cores on systems-on-chip (SoCs), and the percentage of SoCs with mixed-signal content is growing from about 10 percent in 1998 to about 70 to 80 percent in 2006," declared Georges Gielen, a professor at Katholieke Universiteit in Leuven (Belgium) and moderator of the panel.
The bad message, he continued, is that the productivity of analog designers is quite low. It is estimated at about 1 device per hour compared to thousands of devices per hour on the digital side. Moving to the 65-nm process node and below, he identified new obstacles. The supply chain is dropping. The variability is becoming a problem in analog circuits. And, as we integrate different blocks in the circuit, interferences limit its performance.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- IBM and Chartered Team with Synopsys for Mixed-Signal Connectivity IP at 65 NM
- TSMC Unveils New 65-Nanometer Mixed-Signal and RF Tool Qualification Program
- Synopsys Teams With UMC to Port Mixed-Signal Connectivity IP to 90- and 65-Nanometer Process Technologies
- Synopsys Releases Mixed-Signal PHY IP for SMIC 130-nm Process
- Chipidea, Chartered Collaborate to Offer Advanced Mixed-Signal IP at 65nm
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation