Xilinx Announces Production Qualification of Entire Line of Spartan-3A I/O Optimized FPGAs

• Company achieves volume production ahead of schedule
  
• 90nm process improvements result in even lower power

SAN JOSE, Calif., May 8, 2007 – Xilinx, Inc. (NASDAQ: XLNX), the world’s leading programmable logic device (PLD) provider, today announced production qualification of its entire line of 90nm I/O optimized Spartan™-3A platform. This includes all five devices of the Spartan-3A platform including the XC3S50A, XC3S200A, XC3S400A, XC3S700A, and XC3S1400A devices.

With consistent evolution of the architecture and drastic reductions in cost, Xilinx Spartan series FPGAs have continued to expand in usage since their introduction in 1998 to become the number one choice of designers worldwide for use in consumer electronic and automotive applications, including digital displays, mobile phones, PDAs, rear-seat entertainment and satellite navigation systems. The company has delivered over 215 million Spartan FPGAs with cumulative revenues of approximately $2 billion.

 “By achieving production qualification across the Spartan-3A within five months since introduction is a testament to the stability and efficiency of our proven 90nm process technology – the optimum node for high volume FPGAs,” said Christophe Chene, senior director of Marketing and Applications for the General Products Division at Xilinx. “Having a well-established 90nm process and proven tight process controls has resulted in an excellent combination of low power, high performance, and low cost for high-volume applications.”

“Through more than a decade of close collaboration, Xilinx and UMC together have achieved many significant production milestones across multiple process generations,” said Lee Chung, vice president of the Corporate Marketing Division at UMC. “We are delighted to celebrate this new, most recent Spartan-3A accomplishment via our proven, mature 90nm process, and look forward to continuing our successful relationship to enhance Xilinx's leadership position in the FPGA market.”

90nm Process Controls and Improvements Lead to Substantial Power Reduction
Xilinx has also achieved substantial power reduction in its Spartan-3 generation FPGAs through higher yields and fine-tuning of its proven 90nm process technology that first went into production four years ago in April, 2003 with fab partner UMC. Quiescent current (also known as static current) has been reduced by up to 40 percent in Spartan-3 FPGAs and up to 57 percent in Spartan-3E FPGAs. Individual power rail requirements have been reduced by up to 90 percent. Every reduction in quiescent current reduces operating current by the same amount.  Reduced current can provide for lower cost power supplies and less heat in the system, improving reliability.

The latest Spartan generation devices to take advantage of this process, the Spartan-3A, Spartan-3AN, and Spartan-3A DSP platforms are already specified with low quiescent power.  Each of these platforms also includes a Suspend mode that further reduces quiescent power by an additional 40 percent. The new Spartan-3 and Spartan-3E FPGA quiescent current specifications can be found in the product data sheets on xilinx.com.

About the Spartan-3A Platform
The Spartan-3A platform, introduced in December of 2006, provides a cost-reduced solution for applications where I/O count and capabilities matter more than logic density. With support for the industry’s widest range of I/O standards (26) and unique power, configuration capabilities and anti-cloning security advantages, Spartan-3A FPGAs provide a flexible and cost-saving solution to new high-volume applications within consumer and industrial segments, such as display panel interfaces, video/tuner board interfaces and video switching.

About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit www.xilinx.com.

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