Agreement shortens time to deployment for customers targeting 2G/3G baseband solutions
SAN JOSE, Calif. -- May 14, 2007 -- CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], a leading licensor of innovative intellectual property (IP) platform solutions and DSP cores for wireless, consumer and multimedia applications, today announced that InterDigital Communications Corporation has licensed the CEVA-TeakLite™ DSP core for its advanced multi-mode baseband platform solutions. Under the terms of the agreement, InterDigital and its customers can embed the CEVA-TeakLite DSP core into Application Specific Integrated Circuit (ASIC) designs targeting 2G/3G baseband solutions.
Mark Lemmo, Executive Vice President of Business Development and Product Management of InterDigital, stated, "This agreement allows InterDigital to effectively address the requirements of our customers who require a high-value, proven multi-mode baseband solution to be integrated into their next-generation chips. The CEVA-TeakLite is regarded as one of the most successful DSP cores in the semiconductor industry and we are pleased to include this technology as part of our baseband product solution."
"We are pleased to have InterDigital as a licensee, a leader in the development of 2G/3G multi-mode wireless baseband technologies and products," said Gideon Wertheizer, CEO of CEVA. "InterDigital's multi-mode baseband platform solutions, incorporating the CEVA-TeakLite DSP, will enable customers to address the growing opportunities and shorten the time to deployment for customers aiming to develop baseband chips."
The CEVA-TeakLite is a broadly used general-purpose DSP core optimized for low-power and high-performance digital signal processing applications. The core enables a large range of high-volume applications such as cellular handsets, DVDs, disk drives, VoIP gateways, IP phones, mobile audio and more. The core is used as an engine for DSP processing functions such as baseband processing, voice and audio compression, servo control and more. The fully synthesizable, process-independent CEVA-TeakLite can be ported to any ASIC or foundry based designs.
InterDigital Communications Corporation designs, develops, and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G and 802 products worldwide. Additionally, the company offers baseband product solutions and protocol software for 3G multimode terminals and converged devices. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.
For more information, please visit InterDigital's web site: http://www.interdigital.com/
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of innovative intellectual property (IP) platform solutions and DSP cores for wireless, consumer and multimedia applications. CEVA's IP portfolio includes comprehensive platform solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices.
For more information, visit http://www.ceva-dsp.com/