TI takes two approaches to IC manufacturing
(05/13/2007 9:00 AM EDT)
Dallas — Moving to remain competitive in what has become a brave new world of IC manufacturing, Texas Instruments Inc. last week disclosed the details of its revised "hybrid" fab strategy. The chip maker is bolstering its in-house efforts in analog production, but it is also shifting more of its logic-based IC work and process flow to the foundries.
As a result of the shift, TI has pushed out the production ramp date for its new--and still unequipped--300-mm fab in Texas by about 18 months.
Nearly half of TI's logic chip production is outsourced to the foundries today, but that figure could jump to 70 percent over time, according to analysts. TI says it has no intention of going fabless for logic. But the chip maker's foundry partners for the 45-nanometer node--TSMC, UMC and a yet-to-be-determined vendor--will play a much bigger role than TI has afforded foundries in the past. And by 32 nm, TI will co-develop its processes at the foundries, whereas traditionally it has done that work in-house.
By turning over more control of logic process development to its foundry partners, TI is also offloading some of the risk. It's a calculated move as the chip industry approaches a new inflection point in manufacturing, with complex technologies introduced for the 45-nm node and beyond.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Denying China IC Manufacturing Tools
- The MOSIS Service of the USC Information Sciences Institute and SkyWater Collaborate on Silicon IC Design Enablement and Manufacturing Service
- Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES' 22FDX IC manufacturing process
- New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8%
- Long-term Strategy Pays Off As TI Maintains Analog Leadership
Breaking News
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows