Nicolas Mokhoff, EE Times(06/08/2007 12:54 PM EDT) SAN DIEGO, Calif.
— A panel at the Design Automation Conference held here Thursday (June 7) tried to identify the data models that need to be provided for the exchange requirements of silicon intellectual property (IP). For the most part, panelists agreed on the need for standards for IP reuse, but were short on details about taking specific steps toward that goal.
Songjoo Yoo, senior research manager at Samsung's SoC R&D Center, said that "we need a standardized approach to the transfer of IP between provider and receiver as we prepare to design today's very complex SoCs at process technologies of 45 nm and below." Such an approach would enable all to increase design reusability, which will lead to reductions in development cost, said Yoo.
John Goodenough, director of design technology at ARM, said that complex SoCs require IP from multiple sources to be integrated. "Standards for IP interoperability, such as the AMBA or OCP interconnect interfaces, help this at an architectural level and reduce overall system re-verification efforts," he said.
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