Letter to the editor: DSPs for IP (Shaul Berger)
I received a plethora of e-mails regarding my recent article, entitled "Semi IP sector is a lost cause"
Then, I asked for the IP vendors themselves to respond to a set of questions. Here's one letter to the editor:
Editor,
We met in the past and I am (at least I claim to be objective) on this topic, being there and have done it several times. I think you are right on the money and it is not pleasant for companies trying to make money selling IP, to face the reality. The reality is that even many of the top 10 vendors hardly make money and by financial standards (EPS) they are not investor quality grade. I am not expert on the whole IP space but I know very well the DSP IP domain.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Letter to the editor: Darwin's theory on IP (Kalar Rajendiran, eSilicon)
- Letter to the editor: MIPS talks IP
- Letter to the editor: IP, cars share common ground (C. Paul Slaby, Kaben Wireless Silicon)
- Letter to the editor: IP worth its weight (Jim Gobes, CEO, Intrinsix)
- Letter to the editor: Turley speaks out (Patriot Scientific)
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation